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TLV320AIC13IDBTG4

Texas Instruments

TLV320AIC13IDBTG4 by Texas Instruments

TLV320AIC13IDBTG4 by Texas Instruments is an Audio Codec with 2 channels, operating at -40 to 85 °C. It features a 16um resolution, TWOS COMPLEMENT output/input codes, and operates on 1.8/3.3V supplies. Ideal for industrial telecom applications requiring a programmable codec with synchronous operation in a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,853 parts In-Stock

1+ parts

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5,853

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Digiode

USA . 448 parts In-Stock

1+ parts

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448

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,442 parts In-Stock

1+ parts

$6.728

100+ parts

-

1k+ parts

$7.407

10k+ parts

-

1,442

$6.728

-

$7.407

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DigiPath Technology Company

USA . 1,197 parts In-Stock

1+ parts

$7.408

100+ parts

-

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1,197

$7.408

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ChromeModa Solutions

Germany . 6,274 parts In-Stock

1+ parts

$7.559

100+ parts

$6.198

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-

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6,274

$7.559

$6.198

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IDEA Electronic Components Group

UK . 687 parts In-Stock

1+ parts

$7.559

100+ parts

-

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$6.803

10k+ parts

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687

$7.559

-

$6.803

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AZTECH Wire

Italy . 276 parts In-Stock

1+ parts

$16.544

100+ parts

-

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276

$16.544

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Component Stockers USA

USA . 791 parts In-Stock

1+ parts

$99.990

100+ parts

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791

$99.990

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Semicontronic

India . 939 parts In-Stock

1+ parts

$163.000

100+ parts

$158.925

1k+ parts

$158.110

10k+ parts

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939

$163.000

$158.925

$158.110

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Ampacity Inc.

Singapore . 1,446 parts In-Stock

1+ parts

$601.000

100+ parts

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1,446

$601.000

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One Stop Electronics

USA . 1,399 parts In-Stock

1+ parts

$698.000

100+ parts

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1,399

$698.000

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Microchip USA

USA . 2,925 parts In-Stock

1+ parts

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2,925

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Corphita

USA . 906 parts In-Stock

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906

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Corohmni

South Africa . 263 parts In-Stock

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263

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Overview

Enhance your audio experience with the TLV320AIC13IDBTG4 by Texas Instruments, a top-tier manufacturer known for cutting-edge technology. This audio codec offers unparalleled quality and reliability, making it ideal for a wide range of applications in the audio industry. With a compact design and advanced features, this product delivers exceptional value to customers by providing superior sound performance and versatility. Upgrade your audio systems with the TLV320AIC13IDBTG4 and enjoy premium sound quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the audio codec.

Surface Mount: YES

Surface mount design allows for easy installation and integration into circuit boards.

Output Code: TWOS COMPLEMENT

Two's complement output code ensures accurate and precise digital signal processing.

Package Shape: RECTANGULAR

Rectangular shape allows for compact and efficient placement within electronic devices.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures synchronized data communication and processing.

Input Code: TWOS COMPLEMENT

Using two's complement input code maintains consistency and accuracy in signal conversion.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages enables flexibility in system design and compatibility.

No. of Terminals: 30

Having 30 terminals allows for connectivity with multiple external components and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with a thin profile saves space and enhances portability of the audio codec.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range capability allows for usage in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides corrosion resistance and excellent electrical conductivity.

Maximum Output Voltage: 2.35 V

High maximum output voltage ensures strong audio signal amplification capability.

Terminal Position: DUAL

Dual terminal position enables versatile mounting options and ease of connection.

Output (V): VOLTAGE

Output voltage in the form of voltage signal ensures compatibility with various audio systems and devices.

Maximum Seated Height: 1.2 mm

Low seated height allows for slim and compact design of the audio codec module.

Width: 4.4 mm

Narrow width dimension facilitates space-saving integration on circuit boards.

Maximum Analog Input: 2 V

Support for high maximum analog input voltage range allows for handling of strong audio signals.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering during manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability enables durable and reliable solder joints.

Length: 7.8 mm

Compact length dimension contributes to the overall small form factor of the audio codec.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh and demanding industrial environments.

No. of Channels: 2

Support for two channels allows for stereo audio processing and output.

Technology: CMOS

CMOS technology provides low power consumption and compatibility with modern electronic systems.

Terminal Form: GULL WING

Gull wing terminal form enables secure soldering and robust mechanical connection.

Telecom IC Type: PROGRAMMABLE CODEC

Programmable codec functionality offers flexibility in audio processing and custom configurations.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent and reliable operation of the audio codec.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and precise connection with other components.

Resolution (um): 16

16-bit resolution provides high accuracy in digital signal conversion and processing.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level 2 indicates the audio codec's ability to withstand moderate humidity exposure.

Input Type: SINGLE-ENDED/DIFF

Support for both single-ended and differential input types enhances compatibility with various audio sources.

Filter: YES

Inclusion of a filter helps in noise reduction and signal quality improvement in audio processing.

Technical Specifications

Audio Codecs TLV320AIC13IDBTG4 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V ANALOG SUPPLY

Maximum Analog Input:

2 V

Filter:

YES

Input Code:

TWOS COMPLEMENT

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

30

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Maximum Output Voltage:

2.35 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP30,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Resolution (um):

16

Maximum Seated Height:

1.2 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TLV320AIC13IDBTG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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