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TLV320AC41IDWR

Texas Instruments

TLV320AC41IDWR by Texas Instruments

TLV320AC41IDWR by Texas Instruments is an Audio Codec with 20 terminals, operating at -40 to 85°C. It features A-LAW companding law, synchronous/asynchronous mode, and PCM CODEC type for telecom applications. The small outline package measures 12.8mm x 7.5mm x 2.65mm and has a gull wing terminal form factor suitable for industrial temperature grade use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,980

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-

-

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Digiode

USA . 4,272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,272

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,548 parts In-Stock

1+ parts

$9.714

100+ parts

-

1k+ parts

$10.294

10k+ parts

-

1,548

$9.714

-

$10.294

-

AZTECH Wire

Italy . 669 parts In-Stock

1+ parts

$9.972

100+ parts

-

1k+ parts

-

10k+ parts

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669

$9.972

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-

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ChromeModa Solutions

Germany . 2,935 parts In-Stock

1+ parts

$10.915

100+ parts

$8.950

1k+ parts

-

10k+ parts

-

2,935

$10.915

$8.950

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IDEA Electronic Components Group

UK . 2,009 parts In-Stock

1+ parts

$10.915

100+ parts

$10.369

1k+ parts

$9.824

10k+ parts

-

2,009

$10.915

$10.369

$9.824

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One Stop Electronics

USA . 217 parts In-Stock

1+ parts

$514.000

100+ parts

-

1k+ parts

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10k+ parts

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217

$514.000

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Corphita

USA . 2,592 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,592

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DigiPath Technology Company

USA . 1,769 parts In-Stock

1+ parts

-

100+ parts

$9.841

1k+ parts

-

10k+ parts

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1,769

-

$9.841

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Overview

Experience superior audio quality with the TLV320AC41IDWR by Texas Instruments, a leading manufacturer known for delivering top-notch products in the audio codecs category. This versatile PCM codec offers seamless synchronous and asynchronous operation, making it ideal for various applications in telecommunications and audio processing. With a compact design and wide temperature range, this product provides unmatched value and benefits to customers looking for reliable and high-performance solutions. Trust Texas Instruments for cutting-edge technology that meets your audio needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications without adding unnecessary bulk.

Surface Mount: YES

Allows for easy PCB integration and saves space, making the product ideal for compact designs.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Provides flexibility in operation, allowing the product to adapt to different system requirements.

No. of Terminals: 20

Sufficient number of terminals for connecting multiple components, enhancing the versatility of the product.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high-temperature environments, ensuring reliable performance under various conditions.

Filter: YES

Includes a filter to improve the quality of audio signals, making the product suitable for applications that demand clear sound output.

Technical Specifications

Audio Codecs TLV320AC41IDWR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TLV320AC41IDWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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