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TP3054WM-X/63SN

Texas Instruments

TP3054WM-X/63SN by Texas Instruments

TP3054WM-X/63SN by Texas Instruments is an audio codec with +-5V power supplies, 16 terminals, and mu-law companding law. It is a PCM CODEC suitable for industrial temperature grades applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,901 parts In-Stock

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3,901

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Digiode

USA . 738 parts In-Stock

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738

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Distributors (Availability)

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AZTECH Wire

Italy . 440 parts In-Stock

1+ parts

$12.658

100+ parts

-

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440

$12.658

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Parana Technologies

USA . 582 parts In-Stock

1+ parts

$13.210

100+ parts

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$13.716

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582

$13.210

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$13.716

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DigiPath Technology Company

USA . 1,327 parts In-Stock

1+ parts

$14.546

100+ parts

$13.382

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1,327

$14.546

$13.382

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IDEA Electronic Components Group

UK . 1,940 parts In-Stock

1+ parts

$14.843

100+ parts

$14.101

1k+ parts

$13.359

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1,940

$14.843

$14.101

$13.359

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ChromeModa Solutions

Germany . 1,252 parts In-Stock

1+ parts

$14.843

100+ parts

$12.171

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1,252

$14.843

$12.171

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One Stop Electronics

USA . 1,030 parts In-Stock

1+ parts

$368.000

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1,030

$368.000

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Corphita

USA . 3,150 parts In-Stock

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3,150

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Microchip USA

USA . 333 parts In-Stock

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333

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Overview

Discover the ultimate solution for your audio codec needs with the TP3054WM-X/63SN by Texas Instruments. Renowned for their top-quality products, Texas Instruments delivers exceptional performance and reliability. Ideal for a wide range of applications in the telecom industry, this PCM codec offers unmatched value and benefits to customers. From its compact design to its industrial temperature grade, this codec ensures seamless operation and high-quality audio output. Upgrade your audio systems with the TP3054WM-X/63SN and experience the difference in sound quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection for the internal components of the audio codec, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during the manufacturing process.

Power Supplies (V): +-5

The dual power supplies at +-5V provide a stable power source, ensuring consistent performance and reliable operation of the audio codec.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the audio codec to function effectively even in challenging environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the audio codec energy-efficient and reliable for audio processing tasks.

Technical Specifications

Audio Codecs TP3054WM-X/63SN attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

NO

Maximum Gain Tolerance:

.2 dB

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Linear Coding:

NOT AVAILABLE

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-5

Qualification:

Not Qualified

Sub-Category:

Codecs

Maximum Supply Current:

.011 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TP3054WM-X/63SN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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