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TLV320AIC3206RSBT

Texas Instruments

TLV320AIC3206RSBT by Texas Instruments

TLV320AIC3206RSBT by Texas Instruments is a PCM CODEC with 40 terminals in a SQUARE package. It is surface mountable and made of PLASTIC/EPOXY, suitable for telecom applications requiring high-quality audio processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,513 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,513

-

-

-

-

Digiode

USA . 2,257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,257

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 35 parts In-Stock

1+ parts

$6.494

100+ parts

-

1k+ parts

$7.239

10k+ parts

-

35

$6.494

-

$7.239

-

DigiPath Technology Company

USA . 30 parts In-Stock

1+ parts

$7.151

100+ parts

-

1k+ parts

-

10k+ parts

-

30

$7.151

-

-

-

ChromeModa Solutions

Germany . 989 parts In-Stock

1+ parts

$7.297

100+ parts

$5.984

1k+ parts

-

10k+ parts

-

989

$7.297

$5.984

-

-

IDEA Electronic Components Group

UK . 95 parts In-Stock

1+ parts

$7.297

100+ parts

-

1k+ parts

$6.567

10k+ parts

-

95

$7.297

-

$6.567

-

AZTECH Wire

Italy . 644 parts In-Stock

1+ parts

$18.557

100+ parts

-

1k+ parts

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10k+ parts

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644

$18.557

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-

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One Stop Electronics

USA . 976 parts In-Stock

1+ parts

$333.000

100+ parts

-

1k+ parts

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10k+ parts

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976

$333.000

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-

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Corphita

USA . 1,795 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,795

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Overview

Enhance your audio experience with the TLV320AIC3206RSBT by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers top-notch Audio Codecs like no other. Perfect for a variety of applications, this PCM CODEC ensures crystal-clear sound and seamless performance. Say goodbye to subpar audio quality and hello to a world of premium sound with the TLV320AIC3206RSBT. Upgrade your audio system today and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for a wide range of applications while ensuring longevity.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, saving space and making the product suitable for compact designs.

Package Shape: SQUARE

The square shape of the package provides stability and ease of handling, making it a convenient choice for manufacturers.

No. of Terminals: 40

Having 40 terminals allows for a high level of connectivity and versatility in the product, making it compatible with a wide range of devices and systems.

Package Style (Meter): CHIP CARRIER

The chip carrier style of package offers good thermal conductivity and electrical performance, which is essential for maintaining the quality of audio signals in the product.

Terminal Position: QUAD

The quad terminal position provides better stability and secure connections, ensuring reliable performance of the product.

Terminal Form: NO LEAD

The absence of leads reduces the risk of short circuits and enhances the reliability and durability of the product.

Telecom IC Type: PCM CODEC

PCM codec ensures high-quality audio encoding and decoding, offering clear sound output and optimal performance in telecommunications applications.

Technical Specifications

Audio Codecs TLV320AIC3206RSBT attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

No. of Terminals:

40

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

TLV320AIC3206RSBT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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