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TLV320AD13APZ

Texas Instruments

TLV320AD13APZ by Texas Instruments

TLV320AD13APZ by Texas Instruments is an Audio Codec with 100 terminals, operating at 3.3V. It features synchronous mode, ADSL codec type, and a temperature range of -40 to 85°C. Ideal for telecom applications requiring low profile flatpack packaging.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,698 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,698

-

-

-

-

Digiode

USA . 1,768 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,768

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,244 parts In-Stock

1+ parts

$6.973

100+ parts

$647.563

1k+ parts

$6.276

10k+ parts

-

1,244

$6.973

$647.563

$6.276

-

DigiPath Technology Company

USA . 123 parts In-Stock

1+ parts

$7.678

100+ parts

-

1k+ parts

-

10k+ parts

-

123

$7.678

-

-

-

IDEA Electronic Components Group

UK . 609 parts In-Stock

1+ parts

$7.835

100+ parts

-

1k+ parts

$7.052

10k+ parts

-

609

$7.835

-

$7.052

-

ChromeModa Solutions

Germany . 402 parts In-Stock

1+ parts

$7.835

100+ parts

$6.425

1k+ parts

-

10k+ parts

-

402

$7.835

$6.425

-

-

AZTECH Wire

Italy . 397 parts In-Stock

1+ parts

$13.804

100+ parts

-

1k+ parts

-

10k+ parts

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397

$13.804

-

-

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One Stop Electronics

USA . 181 parts In-Stock

1+ parts

$643.000

100+ parts

-

1k+ parts

-

10k+ parts

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181

$643.000

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-

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Corphita

USA . 863 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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863

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Overview

Experience unparalleled audio quality and reliability with the TLV320AD13APZ by Texas Instruments, a leading manufacturer in the industry. This Audio Codec is perfect for a wide range of applications, providing crystal-clear sound and seamless performance. Whether you're designing for ADSL CODEC or other telecom applications, this product offers exceptional value and benefits that will elevate your projects to the next level. Trust in Texas Instruments for superior quality and innovation in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, providing a good balance of strength and cost-effectiveness.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and synchronization, which is crucial for audio processing applications that require accurate data transmission.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V provides the necessary power for the codec to function effectively while also being energy-efficient.

No. of Terminals: 100

Having a high number of terminals allows for a greater range of connectivity options and functionality within the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this codec can perform reliably even in challenging environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this codec suitable for a variety of applications, including those in colder climates or industrial settings.

Telecom IC Type: ADSL CODEC

Being specifically designed for ADSL applications, this codec is optimized for efficient data transmission and processing in telecommunications systems.

Technical Specifications

Audio Codecs TLV320AD13APZ attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Functions:

1

No. of Terminals:

100

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

TLV320AD13APZ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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