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TCM29C13J-00

Texas Instruments

TCM29C13J-00 by Texas Instruments

Texas Instruments TCM29C13J-00 is a PCM CODEC with A/MU-LAW companding law. Operating in synchronous mode, it has 20 terminals in an IN-LINE package style. Ideal for telecom applications, it operates b/w 0°C to 70°C with -5V to +5V supply voltage range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,838 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,838

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-

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Digiode

USA . 2,301 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,301

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 221 parts In-Stock

1+ parts

$5.623

100+ parts

-

1k+ parts

$6.421

10k+ parts

-

221

$5.623

-

$6.421

-

DigiPath Technology Company

USA . 1,858 parts In-Stock

1+ parts

$6.192

100+ parts

$5.696

1k+ parts

-

10k+ parts

-

1,858

$6.192

$5.696

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IDEA Electronic Components Group

UK . 675 parts In-Stock

1+ parts

$6.318

100+ parts

-

1k+ parts

$5.686

10k+ parts

-

675

$6.318

-

$5.686

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ChromeModa Solutions

Germany . 439 parts In-Stock

1+ parts

$6.318

100+ parts

$5.181

1k+ parts

-

10k+ parts

-

439

$6.318

$5.181

-

-

AZTECH Wire

Italy . 539 parts In-Stock

1+ parts

$15.403

100+ parts

-

1k+ parts

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10k+ parts

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539

$15.403

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-

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One Stop Electronics

USA . 842 parts In-Stock

1+ parts

$500.000

100+ parts

-

1k+ parts

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10k+ parts

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842

$500.000

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-

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Corphita

USA . 1,622 parts In-Stock

1+ parts

-

100+ parts

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1,622

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Overview

Enhance your audio experience with the TCM29C13J-00 from Texas Instruments, a top-tier manufacturer known for its high-quality components. As a leading player in the Audio Codecs category, this product offers unparalleled value and benefits to customers looking for superior sound quality and reliability. Perfect for telecommunications applications, this synchronous-operating codec ensures crystal-clear audio transmission with minimal distortion. Trust Texas Instruments to deliver excellence in every aspect of audio technology, and elevate your audio projects with the TCM29C13J-00.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures durability and reliability in various operating environments.

Package Shape: RECTANGULAR

Rectangular shape allows for compact and efficient PCB layout, saving space in electronic devices.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate data transmission and synchronization with other components in the system.

No. of Terminals: 20

Having 20 terminals provides flexibility in connectivity and functionality, allowing for various input and output options.

Package Style (Meter): IN-LINE

The in-line package style makes installation and integration into a system easier and more streamlined.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows the codec to operate reliably even in elevated temperature conditions.

Nominal Supply Voltage: 5 V

Operating at a nominal 5V supply voltage is common and compatible with many electronic systems, making it easy to integrate.

Technical Specifications

Audio Codecs TCM29C13J-00 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-GDIP-T20

Length:

24.195 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM29C13J-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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