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TCM2909J-00

Texas Instruments

TCM2909J-00 by Texas Instruments

TCM2909J-00 by Texas Instruments is an audio codec with 22 terminals, operating in asynchronous mode. It features a companding law of MU-LAW and operates at temperatures from 0 to 70°C. Ideal for PCM codec applications in telecom, this rectangular package has a width of 10.16mm and max seated height of 5.08mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,210 parts In-Stock

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8,210

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Digiode

USA . 1,229 parts In-Stock

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1,229

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 428 parts In-Stock

1+ parts

$9.143

100+ parts

-

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428

$9.143

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Parana Technologies

USA . 82 parts In-Stock

1+ parts

$9.641

100+ parts

-

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$10.232

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82

$9.641

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$10.232

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IDEA Electronic Components Group

UK . 1,349 parts In-Stock

1+ parts

$10.833

100+ parts

$10.291

1k+ parts

$9.750

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-

1,349

$10.833

$10.291

$9.750

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ChromeModa Solutions

Germany . 1,070 parts In-Stock

1+ parts

$10.833

100+ parts

$8.883

1k+ parts

-

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1,070

$10.833

$8.883

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One Stop Electronics

USA . 1,155 parts In-Stock

1+ parts

$561.000

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1,155

$561.000

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Corphita

USA . 4,350 parts In-Stock

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4,350

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DigiPath Technology Company

USA . 1,102 parts In-Stock

1+ parts

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$9.767

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1,102

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$9.767

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Overview

Enhance your audio experience with the TCM2909J-00 by Texas Instruments, a top-of-the-line Audio Codec that delivers unparalleled quality and reliability. Manufactured by the renowned Texas Instruments, this product is perfect for a wide range of applications in the audio industry. With its advanced features and cutting-edge technology, the TCM2909J-00 offers customers exceptional value and benefits, making it the ideal choice for any audio project. Upgrade your sound system today with the TCM2909J-00 and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed body material ensures durability and reliability, making this audio codec suitable for various applications.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for flexible and independent operation, enhancing compatibility with different systems.

No. of Terminals: 22

With 22 terminals, this audio codec offers a wide range of connectivity options, enabling versatile integration in audio systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures stable performance even in demanding environments.

Companding Law: MU-LAW

The use of mu-law companding law helps in optimizing signal-to-noise ratio and dynamic range, resulting in high-quality audio output.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides sufficient power for the audio codec to operate efficiently.

Filter: YES

The presence of a filter helps in removing unwanted noise and distortion from the audio signal, ensuring clear and crisp sound quality.

Technical Specifications

Audio Codecs TCM2909J-00 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-GDIP-T22

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

22

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

21 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

TCM2909J-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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