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TCM2910AJ

Texas Instruments

TCM2910AJ by Texas Instruments

TCM2910AJ by Texas Instruments is a PCM CODEC with +-5,12V power supplies. It operates b/w 0-70°C and features MU-LAW companding law. Ideal for telecom applications due to its 24 terminals and MOS technology in an IN-LINE package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,782 parts In-Stock

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Digiode

USA . 2,266 parts In-Stock

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2,266

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Electronic Expediters

USA . 1,195 parts In-Stock

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Q Components

USA . 18 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 386 parts In-Stock

1+ parts

$10.619

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386

$10.619

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Parana Technologies

USA . 2,138 parts In-Stock

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$13.882

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$14.361

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2,138

$13.882

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$14.361

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DigiPath Technology Company

USA . 428 parts In-Stock

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$15.286

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428

$15.286

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ChromeModa Solutions

Germany . 4,919 parts In-Stock

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$15.598

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$12.790

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4,919

$15.598

$12.790

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IDEA Electronic Components Group

UK . 2,311 parts In-Stock

1+ parts

$15.598

100+ parts

$14.818

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$14.038

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2,311

$15.598

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$14.038

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One Stop Electronics

USA . 495 parts In-Stock

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$89.000

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495

$89.000

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Corphita

USA . 4,430 parts In-Stock

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4,430

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Kepictronics

USA . 190 parts In-Stock

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190

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A-Plus Industry Inc.

USA . 3 parts In-Stock

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Overview

Discover the ultimate audio experience with the TCM2910AJ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. The TCM2910AJ is a game-changer in the Audio Codecs category, offering unparalleled value and benefits to customers. Whether you're looking to enhance your telecommunications systems or improve audio quality in your devices, this product is the perfect solution. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity, which helps in dissipating heat effectively and maintaining the optimal operating temperature of the device.

Power Supplies (V): +-5,12

Support for both positive and negative voltage supplies allows flexibility in power input options, making the codec compatible with a wide range of systems and applications.

No. of Terminals: 24

Having 24 terminals enables the codec to interface with a variety of external components and devices, allowing for versatile connectivity options.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, the codec can withstand harsh environmental conditions and continue to function reliably without overheating.

Companding Law: MU-LAW

The use of MU-Law companding law ensures high-quality audio signal processing and compression, which is essential for maintaining audio fidelity in telecommunications applications.

Technical Specifications

Audio Codecs TCM2910AJ attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

NO

JESD-30 Code:

R-XDIP-T24

Linear Coding:

NOT AVAILABLE

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5,12

Qualification:

Not Qualified

Sub-Category:

Codecs

Surface Mount:

NO

Technology:

MOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TCM2910AJ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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