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TCM2910J

Texas Instruments

TCM2910J by Texas Instruments

TCM2910J by Texas Instruments is a PCM CODEC with +-5,12V power supplies. It features 24 terminals in an IN-LINE package style and operates b/w 0-70°C. Ideal for telecom applications requiring MU-LAW companding law and MOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,063 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,063

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-

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Digiode

USA . 969 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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969

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 221 parts In-Stock

1+ parts

$11.235

100+ parts

-

1k+ parts

-

10k+ parts

-

221

$11.235

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-

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Parana Technologies

USA . 1,680 parts In-Stock

1+ parts

$11.267

100+ parts

-

1k+ parts

$11.700

10k+ parts

-

1,680

$11.267

-

$11.700

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DigiPath Technology Company

USA . 2,252 parts In-Stock

1+ parts

$12.406

100+ parts

$11.413

1k+ parts

-

10k+ parts

-

2,252

$12.406

$11.413

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ChromeModa Solutions

Germany . 4,286 parts In-Stock

1+ parts

$12.659

100+ parts

$10.380

1k+ parts

-

10k+ parts

-

4,286

$12.659

$10.380

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IDEA Electronic Components Group

UK . 1,829 parts In-Stock

1+ parts

$12.659

100+ parts

$12.026

1k+ parts

$11.393

10k+ parts

-

1,829

$12.659

$12.026

$11.393

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One Stop Electronics

USA . 774 parts In-Stock

1+ parts

$90.000

100+ parts

-

1k+ parts

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10k+ parts

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774

$90.000

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Corphita

USA . 4,007 parts In-Stock

1+ parts

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4,007

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Overview

Upgrade your audio experience with the TCM2910J by Texas Instruments. Designed with precision and quality in mind, this audio codec offers unmatched performance for a wide range of applications. From telecommunications to consumer electronics, this versatile product provides crystal-clear sound and reliable operation. Trust in Texas Instruments' renowned expertise in semiconductor manufacturing to deliver top-of-the-line technology that exceeds expectations. Elevate your audio projects with the TCM2910J and enjoy the benefits of superior quality and innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides good thermal conductivity and stability, making it suitable for high temperature applications. This ensures durability and reliable performance of the product.

Power Supplies (V): +-5,12

Support for dual power supplies of +-5V and 12V allows for flexibility in different voltage requirements, making it compatible with a variety of systems.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options, allowing for versatile integration into different circuit designs or setups.

Package Style (Meter): IN-LINE

The in-line package style makes the product easy to install and integrate within a circuit, ensuring efficient use of space and easy assembly.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand higher temperature environments, making it reliable for various industrial applications.

Companding Law: MU-LAW

MU-LAW companding law is widely used in telecommunications for efficient compression of signals, ensuring clear and high-quality audio transmission.

Technology: MOS

MOS technology offers low power consumption and high-speed operation, making the product energy-efficient and responsive for audio processing tasks.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and stable connections, ensuring reliable signal transmission and reducing the risk of connectivity issues in the product.

Telecom IC Type: PCM CODEC

Being a PCM codec telecom IC type, this product is ideal for encoding and decoding voice signals in telecommunication applications, ensuring clear and accurate audio communication.

Technical Specifications

Audio Codecs TCM2910J attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

NO

JESD-30 Code:

R-XDIP-T24

Linear Coding:

NOT AVAILABLE

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5,12

Qualification:

Not Qualified

Sub-Category:

Codecs

Surface Mount:

NO

Technology:

MOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TCM2910J Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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