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TP3054BFNR

Texas Instruments

TP3054BFNR by Texas Instruments

TP3054BFNR by Texas Instruments is a PCM CODEC with MU-LAW companding law. It operates in SYNCHRONOUS/ASYNCHRONOUS mode, has 20 terminals, and supports -5V to 5V supply voltage range. Ideal for telecom applications due to its filter feature and commercial temperature grade suitability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,937 parts In-Stock

1+ parts

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4,937

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Vyrian

USA . 4,320 parts In-Stock

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4,320

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 192 parts In-Stock

1+ parts

$9.233

100+ parts

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192

$9.233

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Parana Technologies

USA . 291 parts In-Stock

1+ parts

$9.608

100+ parts

-

1k+ parts

$10.202

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291

$9.608

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$10.202

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DigiPath Technology Company

USA . 1,203 parts In-Stock

1+ parts

$10.580

100+ parts

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1,203

$10.580

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ChromeModa Solutions

Germany . 3,247 parts In-Stock

1+ parts

$10.796

100+ parts

$8.853

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3,247

$10.796

$8.853

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IDEA Electronic Components Group

UK . 648 parts In-Stock

1+ parts

$10.796

100+ parts

$10.256

1k+ parts

$9.716

10k+ parts

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648

$10.796

$10.256

$9.716

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One Stop Electronics

USA . 955 parts In-Stock

1+ parts

$414.000

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955

$414.000

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Semicontronic

India . 1,556 parts In-Stock

1+ parts

$497.000

100+ parts

$484.575

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$482.090

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1,556

$497.000

$484.575

$482.090

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Corphita

USA . 875 parts In-Stock

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875

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Corohmni

South Africa . 480 parts In-Stock

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480

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Overview

Elevate your audio experience with the TP3054BFNR by Texas Instruments. This high-quality PCM codec offers unparalleled sound performance for a wide range of applications. Manufactured with precision and expertise, this chip carrier package ensures seamless operation in both synchronous and asynchronous modes. With a commercial temperature grade and compact design, this audio codec is perfect for telecom applications where reliability and efficiency are key. Trust Texas Instruments to deliver top-notch products that exceed expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Surface mount design allows for easy and efficient assembly onto circuit boards.

Package Shape: SQUARE

The square shape of the package provides efficient use of space on a circuit board.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes adds versatility to the product for different applications.

No. of Terminals: 20

Having 20 terminals allows for the connection of multiple input and output signals, enhancing the product's functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier style package offers thermal and electrical benefits for better performance and reliability.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the product can withstand heat stress in various environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the product to function in cold conditions without issues.

Terminal Position: QUAD

The quad terminal position provides easy access for connecting and disconnecting the product from a circuit board.

Maximum Seated Height: 4.57 mm

The low maximum seated height helps in compact design layouts for electronic devices.

Width: 8.9662 mm

The compact width dimensions make the product suitable for space-constrained applications.

Companding Law: MU-LAW

The use of the mu-law companding law helps in achieving high-quality audio signal compression and expansion.

Length: 8.9662 mm

Similar to width, the compact length dimensions make the product suitable for tight spaces on a circuit board.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates the product is suitable for standard commercial applications.

Nominal Negative Supply Voltage: -5 V

The negative supply voltage allows for dual power supply configurations and flexibility in system design.

Terminal Form: J BEND

The J bend terminal form makes it easier to solder and connect the product to a circuit board.

Maximum Supply Current: 9 mA

With a low maximum supply current, the product operates efficiently and conserves power.

Telecom IC Type: PCM CODEC

The PCM codec type is commonly used in telecommunications for high-quality audio encoding and decoding.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is standard and compatible with many electronic systems and components.

Terminal Pitch: 1.27 mm

The tight terminal pitch provides high density and connectivity on a circuit board, maximizing functionality.

Filter: YES

The inclusion of a filter helps in reducing noise and interference, enhancing the audio quality of the product.

Technical Specifications

Audio Codecs TP3054BFNR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

S-PQCC-J20

Length:

8.9662 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.9662 mm

Trade Compliance

TP3054BFNR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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