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LM49352RL

Texas Instruments

LM49352RL by Texas Instruments

LM49352RL by Texas Instruments is an audio codec with 36 terminals in a square grid array package. It operates synchronously, with companding law A/MU-LAW and a nominal voltage of 1.8V. Ideal for industrial telecom applications due to its compact size and fine pitch design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,167 parts In-Stock

1+ parts

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5,167

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Digiode

USA . 3,427 parts In-Stock

1+ parts

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3,427

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Anansix

USA . 1,462 parts In-Stock

1+ parts

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1,462

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 679 parts In-Stock

1+ parts

$10.095

100+ parts

-

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679

$10.095

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Parana Technologies

USA . 2,183 parts In-Stock

1+ parts

$10.553

100+ parts

-

1k+ parts

$11.055

10k+ parts

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2,183

$10.553

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$11.055

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ChromeModa Solutions

Germany . 3,656 parts In-Stock

1+ parts

$11.857

100+ parts

$9.723

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3,656

$11.857

$9.723

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IDEA Electronic Components Group

UK . 2,345 parts In-Stock

1+ parts

$11.857

100+ parts

$11.264

1k+ parts

$10.671

10k+ parts

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2,345

$11.857

$11.264

$10.671

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One Stop Electronics

USA . 788 parts In-Stock

1+ parts

$256.000

100+ parts

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788

$256.000

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Corphita

USA . 3,686 parts In-Stock

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3,686

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DigiPath Technology Company

USA . 1,300 parts In-Stock

1+ parts

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100+ parts

$10.690

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1,300

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$10.690

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Overview

Experience superior audio quality with the LM49352RL by Texas Instruments, a leading manufacturer known for its innovative technology. This audio codec is perfect for various applications in the telecom industry, providing clear and crisp sound. With a compact design and wide range of operating temperatures, this product offers unmatched value and benefits to customers looking for high-performance audio solutions. Trust Texas Instruments for top-of-the-line products that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and ensuring longevity.

Surface Mount: YES

Surface mount technology allows for easy installation and makes the product suitable for modern PCB designs.

Package Shape: SQUARE

The square shape helps in efficient use of space on the PCB, allowing for compact and streamlined designs.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and reliable data transfer, making the product ideal for audio processing applications.

No. of Terminals: 36

Having a high number of terminals allows for versatile connectivity options and functionality in the product.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers high density and precision in mounting, enhancing the overall performance of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures reliability in various settings, making the product suitable for diverse applications.

Terminal Position: BOTTOM

Bottom terminal positioning offers easy access and efficient PCB layout, enhancing the user-friendliness of the product.

Maximum Seated Height: 0.725 mm

The low seated height contributes to a compact and slim profile, enabling space-saving installation in limited spaces.

Width: 3.281 mm

The narrow width of the product allows for efficient use of board space and facilitates compact system designs.

Companding Law: A/MU-LAW

The A/MU-law companding law ensures high-quality audio compression and expansion, delivering clear and accurate sound output.

Length: 3.281 mm

The short length of the product contributes to a small footprint on the PCB, enabling versatile placement options in electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification signifies reliable performance in harsh industrial environments, making the product durable and robust.

Terminal Form: BALL

The ball terminal form offers secure connections and easy soldering, ensuring stable electrical connections in the product.

Telecom IC Type: PCM CODEC

The PCM codec type is specifically designed for telecommunications applications, providing high-quality audio encoding and decoding capabilities.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage ensures energy efficiency and compatibility with a wide range of power sources, making the product cost-effective.

Terminal Pitch: 0.5 mm

The fine terminal pitch offers precise and secure connections, enhancing the overall reliability and performance of the product.

Filter: YES

The inclusion of a filter helps in noise reduction and signal clarity, ensuring high-quality audio output in the product.

Technical Specifications

Audio Codecs LM49352RL attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 3.3V ANALOG SUPPLY

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

S-PBGA-B36

Length:

3.281 mm

No. of Functions:

1

No. of Terminals:

36

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.725 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

3.281 mm

Trade Compliance

LM49352RL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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