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S3507I-D

Onsemi

S3507I-D by Onsemi

The Onsemi S3507I-D is a PCM CODEC with 22 terminals, operating in SYNCHRONOUS mode. It has an industrial temperature grade range from -40 to 85 °C and supports MU-LAW companding law. Ideal for telecom applications requiring audio codecs with a nominal voltage of 5 V and negative supply voltage of -5 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,594 parts In-Stock

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Vyrian

USA . 979 parts In-Stock

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979

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Distributors (Availability)

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SupplyDigital Components

Austria . 7,565 parts In-Stock

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Problanco Electronics

Mexico . 5,004 parts In-Stock

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Kulean Microsystems

USA . 4,766 parts In-Stock

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TANS Electronics

Latvia . 3,018 parts In-Stock

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UHIMA Technologies

Türkiye . 575 parts In-Stock

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575

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Corohmni

South Africa . 380 parts In-Stock

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380

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Corphita

USA . 81 parts In-Stock

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Overview

Experience crystal clear sound like never before with the S3507I-D by Onsemi. Crafted with precision and expertise, this audio codec offers unparalleled quality and reliability for a wide range of applications. Whether you're designing professional audio equipment or enhancing communication systems, this product delivers exceptional value, benefits, and advantages that will exceed your expectations. Upgrade to the S3507I-D and immerse yourself in a world of superior audio performance.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material provides durability and protection for the audio codec, ensuring reliability in various conditions.

No. of Terminals: 22

Having 22 terminals allows for versatile connectivity options and functionality, making this audio codec suitable for a range of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this audio codec can withstand and perform well in demanding environments without overheating.

Companding Law: MU-LAW

The use of MU-Law companding law ensures high-quality audio compression and decompression, resulting in clear and accurate sound reproduction.

Nominal Negative Supply Voltage: -5 V

The nominal negative supply voltage of -5V provides stable and consistent power to the audio codec, contributing to its reliable performance.

Technical Specifications

Audio Codecs S3507I-D attributes and parameters. Explore more Audio Codecs devices from Onsemi

Specs

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-GDIP-T22

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

22

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

S3507I-D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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