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TLV320AIC3206IRSBR

Texas Instruments

TLV320AIC3206IRSBR by Texas Instruments

TLV320AIC3206IRSBR by Texas Instruments is an Audio Codec with 2 channels, operating at -40 to 85°C. It features a PCM CODEC for single-ended/diff input and synchronous mode. Ideal for industrial applications requiring voltage output in a compact chip carrier package.

Median Price

$3.846

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 24,120 parts In-Stock

1+ parts

$3.846

100+ parts

$3.135

1k+ parts

$2.090

10k+ parts

-

24,120

$3.846

$3.135

$2.090

-

DigiKey

USA . 4,596 parts In-Stock

1+ parts

$5.160

100+ parts

$3.291

1k+ parts

$2.955

10k+ parts

$2.857

4,596

$5.160

$3.291

$2.955

$2.857

Mouser Electronics

USA . 1,840 parts In-Stock

1+ parts

$5.160

100+ parts

$3.300

1k+ parts

$2.960

10k+ parts

$2.850

1,840

$5.160

$3.300

$2.960

$2.850

Rochester

USA . 2,868 parts In-Stock

1+ parts

-

100+ parts

$2.620

1k+ parts

$2.350

10k+ parts

$2.210

2,868

-

$2.620

$2.350

$2.210

Verical

USA . 2,868 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.938

10k+ parts

$2.763

2,868

-

-

$2.938

$2.763

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,808 parts In-Stock

1+ parts

$2.755

100+ parts

-

1k+ parts

-

10k+ parts

-

4,808

$2.755

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.546

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$3.546

-

-

-

Vyrian

USA . 8,013 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,013

-

-

-

-

Chip Stock

USA . 3,116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,116

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7,853 parts In-Stock

1+ parts

$2.460

100+ parts

-

1k+ parts

-

10k+ parts

-

7,853

$2.460

-

-

-

Corphita

USA . 1,595 parts In-Stock

1+ parts

$2.610

100+ parts

-

1k+ parts

-

10k+ parts

-

1,595

$2.610

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

$3.546

100+ parts

-

1k+ parts

$3.369

10k+ parts

$3.298

500

$3.546

-

$3.369

$3.298

Parana Technologies

USA . 985 parts In-Stock

1+ parts

$14.771

100+ parts

-

1k+ parts

$15.209

10k+ parts

-

985

$14.771

-

$15.209

-

DigiPath Technology Company

USA . 1,896 parts In-Stock

1+ parts

$16.265

100+ parts

$14.964

1k+ parts

-

10k+ parts

-

1,896

$16.265

$14.964

-

-

ChromeModa Solutions

Germany . 428 parts In-Stock

1+ parts

$16.597

100+ parts

$13.610

1k+ parts

-

10k+ parts

-

428

$16.597

$13.610

-

-

IDEA Electronic Components Group

UK . 74 parts In-Stock

1+ parts

$16.597

100+ parts

$15.767

1k+ parts

$14.937

10k+ parts

-

74

$16.597

$15.767

$14.937

-

Lixinc

USA . 11,476 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,476

-

-

-

-

A-Z Elektronik GmbH

Germany . 8,769 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,769

-

-

-

-

Kepictronics

USA . 8,607 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,607

-

-

-

-

Perfect Parts

USA . 560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

560

-

-

-

-

Overview

Experience the unparalleled sound quality and reliability of Texas Instruments with the TLV320AIC3206IRSBR Audio Codec. Perfect for a wide range of applications, this high-performance chip carrier offers exceptional audio processing capabilities in a compact and durable package. With a temperature range suitable for industrial use, no lead terminal form, and advanced features like filters and synchronous operation, this codec is designed to elevate your audio experience. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and brings value to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and synchronization in data transmission.

No. of Terminals: 40

Having 40 terminals enables versatile connectivity options for various audio inputs and outputs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperature environments.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage of 1.8V helps in reducing power consumption and improving efficiency.

No. of Channels: 2

Having 2 channels allows for stereo sound output, enhancing the audio experience.

Filter: YES

The presence of a filter helps in cleaning up the audio signal and reducing noise interference.

Technical Specifications

Audio Codecs TLV320AIC3206IRSBR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

40

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

VOLTAGE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TLV320AIC3206IRSBR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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