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TLV320AIC13CDBTR

Texas Instruments

TLV320AIC13CDBTR by Texas Instruments

TLV320AIC13CDBTR by Texas Instruments is a 2-channel audio codec with 16um resolution, operating at 1.8V and 3.3V. It features two's complement output/input codes, synchronous operation, and a small outline package suitable for telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,205 parts In-Stock

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Digiode

USA . 613 parts In-Stock

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613

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Parana Technologies

USA . 1,716 parts In-Stock

1+ parts

$5.554

100+ parts

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$6.329

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1,716

$5.554

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$6.329

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DigiPath Technology Company

USA . 1,778 parts In-Stock

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$6.115

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$5.626

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1,778

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ChromeModa Solutions

Germany . 6,762 parts In-Stock

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$6.240

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$5.117

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$6.240

$5.117

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IDEA Electronic Components Group

UK . 334 parts In-Stock

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$6.240

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$5.616

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334

$6.240

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$5.616

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AZTECH Wire

Italy . 791 parts In-Stock

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$13.768

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Component Stockers USA

USA . 636 parts In-Stock

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$99.990

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636

$99.990

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One Stop Electronics

USA . 489 parts In-Stock

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$838.000

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Ampacity Inc.

Singapore . 1,079 parts In-Stock

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$949.000

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Corphita

USA . 1,187 parts In-Stock

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Microchip USA

USA . 495 parts In-Stock

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495

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Overview

Enhance your audio experience with the TLV320AIC13CDBTR by Texas Instruments. As a leader in audio codecs, Texas Instruments delivers top-notch quality and reliability. This versatile device is perfect for applications such as smartphones, tablets, and portable media players. With its advanced features and compact design, the TLV320AIC13CDBTR offers customers exceptional value and unparalleled performance. Upgrade your audio system today with Texas Instruments and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable audio devices.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into circuit boards, saving space and simplifying assembly.

Output Code: TWOS COMPLEMENT

Twos complement output code provides high precision in digital signal processing applications, ensuring accurate audio conversion.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures synchronized and consistent data processing, minimizing any potential signal interference or distortion.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows for flexibility in system design, catering to different power requirements.

No. of Terminals: 30

The ample number of terminals provides connectivity options that can accommodate various input and output configurations.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures reliability and performance in different environmental conditions.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage allows for energy-efficient operation, reducing power consumption and extending battery life.

Technical Specifications

Audio Codecs TLV320AIC13CDBTR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V ANALOG SUPPLY

Maximum Analog Input:

2 V

Filter:

YES

Input Code:

TWOS COMPLEMENT

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

30

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Maximum Output Voltage:

2.35 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP30,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Resolution (um):

16

Maximum Seated Height:

1.2 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TLV320AIC13CDBTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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