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TP3094V

Texas Instruments

TP3094V by Texas Instruments

TP3094V by Texas Instruments is a 44-terminal audio codec with synchronous operation and 5V power supply. It features A/MU-LAW companding law, operates in industrial temperature grade, and is ideal for PCM codec applications in telecom ICs.

Median Price

$6.695

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 19 parts In-Stock

1+ parts

$6.695

100+ parts

$7.030

1k+ parts

$6.628

10k+ parts

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19

$6.695

$7.030

$6.628

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Vyrian

USA . 8,655 parts In-Stock

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Digiode

USA . 4,315 parts In-Stock

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4,315

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Anansix

USA . 2,789 parts In-Stock

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2,789

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LWI Electronics Inc

India . 25 parts In-Stock

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25

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Prism Electronics

USA . 25 parts In-Stock

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25

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Halfin

Belgium . 5 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,768 parts In-Stock

1+ parts

$11.305

100+ parts

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$11.739

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1,768

$11.305

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$11.739

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DigiPath Technology Company

USA . 1,252 parts In-Stock

1+ parts

$12.448

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1,252

$12.448

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ChromeModa Solutions

Germany . 2,860 parts In-Stock

1+ parts

$12.702

100+ parts

$10.416

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2,860

$12.702

$10.416

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IDEA Electronic Components Group

UK . 266 parts In-Stock

1+ parts

$12.702

100+ parts

$12.067

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$11.432

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266

$12.702

$12.067

$11.432

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AZTECH Wire

Italy . 261 parts In-Stock

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$19.636

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261

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Component Stockers USA

USA . 700 parts In-Stock

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$99.990

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700

$99.990

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One Stop Electronics

USA . 762 parts In-Stock

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$673.000

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762

$673.000

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Microchip USA

USA . 2,919 parts In-Stock

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Corphita

USA . 1,185 parts In-Stock

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1,185

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Perfect Parts

USA . 237 parts In-Stock

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237

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GreenTree Electronics

Israel . 187 parts In-Stock

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187

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Overview

Experience crystal-clear audio quality like never before with the TP3094V by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled performance and reliability in their audio codecs. Perfect for a wide range of applications, this chip carrier package ensures synchronous operation and precise companding law for optimal sound output. With a nominal supply voltage of 5V and low power consumption, the TP3094V is a cost-effective solution that provides exceptional value and superior performance for all your audio needs. Elevate your audio experience with Texas Instruments TP3094V today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material makes the product lightweight and durable, ideal for portable audio devices.

Operating Mode: SYNCHRONOUS

The SYNCHRONOUS operation mode ensures accurate and synchronized data transmission, resulting in high-quality audio output.

Companding Law: A/MU-LAW

The A/MU-LAW companding law allows for efficient compression and expansion of audio signals, preserving sound quality during transmission.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high performance, making it an energy-efficient choice for audio applications.

Technical Specifications

Audio Codecs TP3094V attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e0

Length:

16.51 mm

Linear Coding:

NOT AVAILABLE

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

44

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

220

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Codecs

Maximum Supply Current:

.05 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16.51 mm

Trade Compliance

TP3094V Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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