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TCM29C16J

Texas Instruments

TCM29C16J by Texas Instruments

Texas Instruments TCM29C16J is a PCM CODEC with +-5V power supplies, 16 terminals, and CMOS technology. It operates in synchronous/asynchronous mode with mu-law companding law for telecom applications. Package style is in-line, rectangular shape with ceramic, glass-sealed material.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,568 parts In-Stock

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Vyrian

USA . 2,619 parts In-Stock

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Q Components

USA . 162 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 69 parts In-Stock

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EMSNET

USA . 21 parts In-Stock

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Prism Electronics

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 3 parts In-Stock

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Parana Technologies

USA . 2,132 parts In-Stock

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$8.054

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$8.640

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ChromeModa Solutions

Germany . 3,515 parts In-Stock

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$9.050

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$7.421

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IDEA Electronic Components Group

UK . 2,223 parts In-Stock

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$9.050

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$8.598

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$8.145

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AZTECH Wire

Italy . 510 parts In-Stock

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$19.530

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510

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One Stop Electronics

USA . 666 parts In-Stock

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$334.000

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DigiPath Technology Company

USA . 2,172 parts In-Stock

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$8.159

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Corphita

USA . 1,412 parts In-Stock

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Perfect Parts

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Overview

Experience crystal-clear audio quality like never before with the TCM29C16J by Texas Instruments. Crafted with precision and excellence, this audio codec offers unrivaled performance and reliability. Designed for a wide range of applications in the telecom industry, this product ensures seamless communication with its synchronous/asynchronous operating mode. With its compact size and durable ceramic, glass-sealed package, the TCM29C16J is perfect for your audio encoding needs. Trust Texas Instruments to deliver top-notch products that exceed your expectations every time. Elevate your audio experience with the TCM29C16J today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed materials ensures durability and protection against environmental factors, making this product a reliable choice for long-term use.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different communication setups, allowing for seamless integration with various systems.

Power Supplies (V): +-5

The wide power supply range of +-5V allows for compatibility with different power sources, making it versatile and suitable for a variety of applications.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options, enabling the product to interface with multiple devices and peripherals efficiently.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high reliability, making the product energy-efficient and long-lasting.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a common standard in many electrical systems, ensuring compatibility and ease of integration with existing setups.

Technical Specifications

Audio Codecs TCM29C16J attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.08 dB

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TCM29C16J Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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