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TLV320AIC20IPFBRG4

Texas Instruments

TLV320AIC20IPFBRG4 by Texas Instruments

TLV320AIC20IPFBRG4 by Texas Instruments is a 48-terminal audio codec with 2 channels. It operates in synchronous mode, with input/output codes in twos complement format. Ideal for telecom applications, it offers a max output voltage of 2.35V and supports single-ended/differential inputs with a resolution of 16um.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,456 parts In-Stock

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Vyrian

USA . 3,067 parts In-Stock

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3,067

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AZTECH Wire

Italy . 462 parts In-Stock

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$7.041

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462

$7.041

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Parana Technologies

USA . 1,661 parts In-Stock

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$7.931

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$8.491

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$7.931

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$8.491

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DigiPath Technology Company

USA . 1,407 parts In-Stock

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$8.733

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$8.034

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$8.733

$8.034

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ChromeModa Solutions

Germany . 4,295 parts In-Stock

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$8.911

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$7.307

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$8.911

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IDEA Electronic Components Group

UK . 57 parts In-Stock

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$8.911

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$8.465

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$8.020

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57

$8.911

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$8.020

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One Stop Electronics

USA . 454 parts In-Stock

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$780.000

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Semicontronic

India . 394 parts In-Stock

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$893.000

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$870.675

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$866.210

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Corphita

USA . 1,303 parts In-Stock

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Microchip USA

USA . 1,099 parts In-Stock

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Corohmni

South Africa . 136 parts In-Stock

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Overview

Experience superior audio quality with the TLV320AIC20IPFBRG4 from Texas Instruments. As a leader in audio codecs, Texas Instruments delivers top-notch performance and reliability. This innovative product is perfect for a wide range of applications in the audio industry. With its advanced features and high-quality design, the TLV320AIC20IPFBRG4 offers exceptional value and benefits to customers looking for a cutting-edge solution. Upgrade your audio experience today with this exceptional product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the audio codec.

Surface Mount: YES

The surface mount feature makes installation easier and more convenient.

Output Code: TWOS COMPLEMENT

The use of twos complement ensures accurate and efficient output encoding.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easier integration into electronic systems.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise synchronization and timing in audio processing.

Input Code: TWOS COMPLEMENT

Matching input and output encoding (twos complement) helps maintain data integrity throughout the processing chain.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows for flexibility in different system configurations.

No. of Terminals: 48

The high number of terminals enables connectivity with various other components in the system.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The package style options offer versatility in mounting and space constraints.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in a variety of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature also contributes to the codec's ability to function in different environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold provides excellent conductivity and corrosion resistance for the terminals.

Maximum Output Voltage: 2.35 V

The high maximum output voltage allows for strong audio signal output.

Terminal Position: QUAD

The quad terminal position facilitates easy connection and integration in circuitry.

Output (V): VOLTAGE

Output in voltage form provides compatibility with various audio systems.

Maximum Seated Height: 1.2 mm

The low seated height enables a compact design for the codec.

Width: 7 mm

The width dimension contributes to the codec's overall compactness and ease of integration.

Maximum Analog Input: 2 V

Support for high analog input voltage allows for handling of strong audio signals.

Maximum Time At Peak Reflow Temperature (s): 30

The codec can withstand reflow soldering processes for up to 30 seconds, ensuring secure mounting.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures stability during manufacturing processes.

Length: 7 mm

The length dimension complements the width and seated height for a compact codec design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification ensures reliability in harsh operating conditions.

No. of Channels: 2

Dual channels allow for stereo audio processing and output.

Technology: CMOS

CMOS technology offers low power consumption and compatibility with various digital systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and connection to PCBs.

Telecom IC Type: PROGRAMMABLE CODEC

Being a programmable codec, it offers flexibility in audio processing and customization.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage ensures efficient power usage and compatibility with standard voltage levels.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for compact terminal layout and smaller package size.

Resolution (um): 16

The high resolution enables accurate audio signal processing and reproduction.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates moderate sensitivity to moisture, suitable for typical operating environments.

Input Type: SINGLE-ENDED/DIFF

Support for both single-ended and differential input types provides flexibility in audio input connections.

Filter: YES

Having a built-in filter enhances audio signal quality and reduces noise interference.

Technical Specifications

Audio Codecs TLV320AIC20IPFBRG4 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V ANALOG SUPPLY

Maximum Analog Input:

2 V

Filter:

YES

Input Code:

TWOS COMPLEMENT

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Maximum Output Voltage:

2.35 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Resolution (um):

16

Maximum Seated Height:

1.2 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TLV320AIC20IPFBRG4 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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