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ST5092TQFPTR

STMicroelectronics

ST5092TQFPTR by STMicroelectronics

ST5092TQFPTR by STMicroelectronics is a 44-terminal audio codec with 14-bit linear coding and A/MU-law companding law. Operating at 3/3.3V, it features synchronous mode and low profile flatpack package style for telecom applications. With a temperature range of -30 to 85 °C, this quad-terminal codec offers a max supply current of 7mA and includes filters for enhanced performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,407 parts In-Stock

1+ parts

-

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1k+ parts

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4,407

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LWI Electronics Inc

India . 3,400 parts In-Stock

1+ parts

-

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1k+ parts

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3,400

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Vyrian

USA . 2,447 parts In-Stock

1+ parts

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2,447

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Anansix

USA . 119 parts In-Stock

1+ parts

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119

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,890 parts In-Stock

1+ parts

$11.101

100+ parts

-

1k+ parts

$9.991

10k+ parts

-

1,890

$11.101

-

$9.991

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MKK Technologies

India . 1,135 parts In-Stock

1+ parts

$20.874

100+ parts

-

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10k+ parts

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1,135

$20.874

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DigiPath Technology Company

USA . 1,135 parts In-Stock

1+ parts

$20.874

100+ parts

-

1k+ parts

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10k+ parts

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1,135

$20.874

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A-Z Elektronik GmbH

Germany . 6,954 parts In-Stock

1+ parts

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6,954

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Corphita

USA . 2,130 parts In-Stock

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2,130

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Parana Technologies

USA . 1,762 parts In-Stock

1+ parts

-

100+ parts

$13.273

1k+ parts

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10k+ parts

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1,762

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$13.273

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Overview

Discover the superior audio quality and reliability of the ST5092TQFPTR from STMicroelectronics, a leading manufacturer in the industry. Ideal for a wide range of applications, this innovative audio codec offers unmatched value and benefits to customers. With its compact square package design and synchronous operating mode, this codec delivers top-notch performance while maintaining a low profile. Trust in STMicroelectronics to provide cutting-edge technology that meets your audio needs with precision and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is durable and lightweight, making the product easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easy assembly and installation, making the product suitable for mass production.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and synchronization, resulting in high performance audio processing.

Power Supplies (V): 3/3.3

The dual power supply options provide flexibility and compatibility with different voltage requirements in various applications.

No. of Terminals: 44

With a high number of terminals, the product offers multiple connectivity options and features for advanced audio codec functionality.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile flatpack design saves space and enhances the product's portability and integration into compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in challenging environmental conditions.

Minimum Operating Temperature: -30 °C

The wide range of minimum operating temperature allows the product to function effectively in both warm and cold environments.

Terminal Finish: TIN LEAD

The tin lead finish provides good solderability and conductivity for secure terminal connections.

Linear Coding: 14-BIT

The 14-bit linear coding offers high-resolution audio processing for clear and accurate sound reproduction.

Maximum Seated Height: 1.6 mm

The low maximum seated height facilitates a slimmer and more streamlined product design.

Width: 10 mm

The compact width dimension enables easy integration into tight spaces or small electronic devices.

Companding Law: A/MU-LAW

The A/MU-law companding law ensures efficient compression and expansion of audio signals, leading to better signal-to-noise ratio.

Length: 10 mm

The short length dimension contributes to the product's overall compactness and space-saving design.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, enhancing the product's efficiency and reliability.

Terminal Form: GULL WING

The gull wing terminal form provides secure and stable terminal connections for improved performance and durability.

Maximum Supply Current: 7 mA

The low maximum supply current helps reduce power consumption and prolong the product's battery life.

Telecom IC Type: LINEAR CODEC

Being a linear codec specifically designed for telecom applications, this product delivers high-quality audio performance for voice communications.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is a common standard in electronic devices, ensuring compatibility and ease of integration.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for compact terminal layout and supports high-density packaging for space-efficient designs.

Maximum Gain Tolerance: 0.5 dB

The low maximum gain tolerance ensures accurate and consistent audio output, maintaining high fidelity in signal processing.

Filter: YES

The presence of a filter enhances the product's audio quality by removing unwanted noise and interference from the signal.

Technical Specifications

Audio Codecs ST5092TQFPTR attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.5 dB

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e0

Length:

10 mm

Linear Coding:

14-BIT

No. of Functions:

1

No. of Terminals:

44

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Codecs

Maximum Supply Current:

7 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

ST5092TQFPTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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