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M5116N

STMicroelectronics

M5116N by STMicroelectronics

STMicroelectronics' M5116N is a PCM CODEC with +-5V power supplies, 16 terminals, and 10mA max supply current. Ideal for telecom applications, it operates b/w 0-70 °C in commercial grade CMOS technology with MU-LAW companding law.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,269 parts In-Stock

1+ parts

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1k+ parts

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10k+ parts

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2,269

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Anansix

USA . 1,294 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,294

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Digiode

USA . 1,067 parts In-Stock

1+ parts

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100+ parts

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1,067

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,686 parts In-Stock

1+ parts

$10.194

100+ parts

-

1k+ parts

$9.174

10k+ parts

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1,686

$10.194

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$9.174

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MKK Technologies

India . 1,868 parts In-Stock

1+ parts

$19.168

100+ parts

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10k+ parts

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1,868

$19.168

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DigiPath Technology Company

USA . 1,868 parts In-Stock

1+ parts

$19.168

100+ parts

-

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10k+ parts

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1,868

$19.168

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Parana Technologies

USA . 906 parts In-Stock

1+ parts

-

100+ parts

$12.188

1k+ parts

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10k+ parts

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906

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$12.188

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Corphita

USA . 520 parts In-Stock

1+ parts

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520

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Overview

Elevate your audio experience with the M5116N by STMicroelectronics. Designed with precision and quality in mind, this PCM CODEC offers unparalleled performance and reliability. Whether you're looking to enhance your telecommunications systems or improve your audio recording equipment, this versatile device is the perfect solution. With a temperature grade of commercial and a compact, rectangular package style, the M5116N provides ease of use and flexibility for a wide range of applications. Trust STMicroelectronics to deliver cutting-edge technology that delivers exceptional value and benefits to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, perfect for portable or long-term use.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and placement in various electronic devices or circuit boards.

Power Supplies (V): +-5

The dual power supplies ensure stable and reliable performance, reducing the risk of voltage fluctuations impacting the audio quality.

No. of Terminals: 16

The 16 terminals provide ample connectivity options for various input and output connections, making the codec versatile for different applications.

Package Style (Meter): IN-LINE

The in-line package style allows for easy installation and efficient use of space in a circuit layout.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in warmer environments or during extended use.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the codec can still function effectively in colder conditions without any performance issues.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good conductivity and solderability, ensuring a reliable electrical connection.

Terminal Position: DUAL

The dual terminal position allows for easy integration and connectivity in different circuit configurations.

Companding Law: MU-LAW

The mu-law companding law ensures efficient compression and expansion of audio signals, maintaining high quality sound transmission.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the codec is suitable for typical operating conditions found in commercial electronics.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance and efficiency of the codec.

Nominal Negative Supply Voltage: -5 V

The negative supply voltage allows for proper biasing and operation of the codec, ensuring correct audio signal processing.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides easy soldering and secure connections, making installation and maintenance hassle-free.

Maximum Supply Current: 10 mA

The low maximum supply current helps in efficient power management and ensures minimal power consumption during operation.

Telecom IC Type: PCM CODEC

The PCM codec is specifically designed for telecom applications, ensuring clear and accurate voice communication.

Nominal Supply Voltage: 5 V

The nominal supply voltage ensures stable and consistent power delivery to the codec for optimal performance.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy connection with standard spacing, facilitating compatibility with various circuit designs.

Maximum Gain Tolerance: 1.25 dB

The maximum gain tolerance ensures precise control over the audio levels, maintaining the desired sound output without distortion.

Technical Specifications

Audio Codecs M5116N attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Companding Law:

MU-LAW

Filter:

NO

Maximum Gain Tolerance:

1.25 dB

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Sub-Category:

Codecs

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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