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TLV320AIC1103GQE

Texas Instruments

TLV320AIC1103GQE by Texas Instruments

TLV320AIC1103GQE by Texas Instruments is a 15-bit audio codec with companding law A/MU-LAW. Operating at 3V, it features synchronous mode and very thin profile grid array package. Ideal for PCM codec applications in industrial temperature range from -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,262 parts In-Stock

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6,262

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Digiode

USA . 488 parts In-Stock

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488

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Distributors (Availability)

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Parana Technologies

USA . 1,885 parts In-Stock

1+ parts

$5.606

100+ parts

-

1k+ parts

$6.402

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1,885

$5.606

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$6.402

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DigiPath Technology Company

USA . 1,636 parts In-Stock

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$6.173

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1,636

$6.173

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ChromeModa Solutions

Germany . 1,563 parts In-Stock

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$6.299

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$5.165

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1,563

$6.299

$5.165

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IDEA Electronic Components Group

UK . 1,469 parts In-Stock

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$6.299

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$5.669

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1,469

$6.299

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$5.669

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AZTECH Wire

Italy . 667 parts In-Stock

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$15.640

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667

$15.640

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One Stop Electronics

USA . 778 parts In-Stock

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$840.000

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778

$840.000

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Corphita

USA . 1,155 parts In-Stock

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Overview

Elevate your audio experience with the TLV320AIC1103GQE from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This Audio Codec is perfect for a wide range of applications, offering customers unparalleled value and benefits. Enhance the sound quality of your devices with this innovative solution that provides crystal clear audio performance and advanced features. Trust Texas Instruments to deliver exceptional products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the audio codec, ensuring a longer lifespan and reliability.

Surface Mount: YES

Surface mount capability makes it easy to integrate this audio codec into circuit boards, saving space and simplifying assembly processes.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for reliable data transfer and synchronization, crucial for audio processing applications that require precise timing.

Power Supplies (V): 3

Operating at a standard voltage of 3V makes this audio codec compatible with a wide range of systems and power sources.

No. of Terminals: 80

Having 80 terminals enables this audio codec to interface with multiple components and systems, allowing for versatile connectivity options.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this audio codec can withstand elevated temperatures in various environments without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40°C ensures that this audio codec remains functional even in extreme cold conditions.

Linear Coding: 15-BIT

15-bit linear coding provides high-resolution audio output, ensuring clear and accurate sound reproduction.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating indicates that this audio codec is suitable for rugged and harsh industrial environments where reliable performance is essential.

Technology: CMOS

CMOS technology offers low power consumption and high reliability, making this audio codec energy-efficient and dependable for long-term use.

Filter: YES

Having a built-in filter enhances the audio quality by reducing noise and distortion, resulting in a cleaner and more refined sound output.

Technical Specifications

Audio Codecs TLV320AIC1103GQE attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

S-PBGA-B80

Length:

5 mm

Linear Coding:

15-BIT

No. of Functions:

1

No. of Terminals:

80

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Codecs

Maximum Supply Current:

.007 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Trade Compliance

TLV320AIC1103GQE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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