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TCM320AC41IDW

Texas Instruments

TCM320AC41IDW by Texas Instruments

TCM320AC41IDW by Texas Instruments is a 20-terminal audio codec with 13-bit linear coding and A-Law companding law. Operating at 5V, it has synchronous/asynchronous modes and is ideal for PCM codec applications in industrial temperature environments. With a small outline package style, it offers filter functionality and consumes up to 7.5mA of supply current.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,234 parts In-Stock

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2,234

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Digiode

USA . 681 parts In-Stock

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681

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 737 parts In-Stock

1+ parts

$11.002

100+ parts

-

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737

$11.002

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Parana Technologies

USA . 1,094 parts In-Stock

1+ parts

$11.354

100+ parts

-

1k+ parts

$11.781

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1,094

$11.354

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$11.781

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DigiPath Technology Company

USA . 18 parts In-Stock

1+ parts

$12.502

100+ parts

$11.502

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18

$12.502

$11.502

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ChromeModa Solutions

Germany . 5,988 parts In-Stock

1+ parts

$12.757

100+ parts

$10.461

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5,988

$12.757

$10.461

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IDEA Electronic Components Group

UK . 2,182 parts In-Stock

1+ parts

$12.757

100+ parts

$12.119

1k+ parts

$11.481

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2,182

$12.757

$12.119

$11.481

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One Stop Electronics

USA . 694 parts In-Stock

1+ parts

$441.000

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694

$441.000

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Corphita

USA . 2,454 parts In-Stock

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2,454

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Overview

Experience top-tier audio quality with the TCM320AC41IDW by Texas Instruments, a leading manufacturer known for its cutting-edge technology. This Audio Codec is perfect for a variety of applications, offering seamless integration and high-performance results. Whether you're looking to enhance your telecommunication system or improve your audio recording equipment, this product delivers unmatched value, benefits, and advantages that will exceed your expectations. Trust Texas Instruments for superior quality and reliability in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable audio devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different audio processing applications.

Power Supplies (V): 5

The standard power supply of 5V ensures compatibility with most audio systems and simplifies integration.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the product suitable for use in various environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance and efficiency.

Telecom IC Type: PCM CODEC

The PCM codec technology ensures high-quality digital audio conversion, resulting in clear and accurate sound reproduction.

Technical Specifications

Audio Codecs TCM320AC41IDW attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TCM320AC41IDW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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