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LC07424LP

Onsemi

LC07424LP by Onsemi

LC07424LP by Onsemi is a PCM CODEC with 40 terminals in a SQUARE package. Operating at 2.8V, it features SYNCHRONOUS mode and includes a filter. Ideal for telecom applications, this chip carrier has a very thin profile and measures 5x5mm in size.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,748 parts In-Stock

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Vyrian

USA . 1,747 parts In-Stock

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1,747

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Kulean Microsystems

USA . 5,093 parts In-Stock

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5,093

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TANS Electronics

Latvia . 5,056 parts In-Stock

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SupplyDigital Components

Austria . 3,552 parts In-Stock

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Corphita

USA . 1,030 parts In-Stock

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UHIMA Technologies

Türkiye . 974 parts In-Stock

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Problanco Electronics

Mexico . 585 parts In-Stock

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Corohmni

South Africa . 74 parts In-Stock

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Overview

Upgrade your audio experience with the LC07424LP by Onsemi! As a leading manufacturer in the industry, Onsemi guarantees top-quality audio codecs that deliver unmatched performance and reliability. Ideal for a variety of applications, this surface mount chip carrier boasts a very thin profile and synchronous operating mode for seamless integration. With 40 terminals and advanced CMOS technology, this PCM codec offers crystal-clear sound and efficient power consumption. Elevate your projects with the LC07424LP and discover the difference Onsemi can make in your audio solutions.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes this product easy to mount on PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

The square shape of the package provides a compact design, making it suitable for applications where space is limited.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and synchronization, making it ideal for applications that require accurate data transmission.

No. of Terminals: 40

The high number of terminals allows for versatile connectivity options, enhancing the functionality of the audio codec.

Package Style: CHIP CARRIER, VERY THIN PROFILE

The thin profile of the chip carrier package style saves space and allows for a compact design, making it suitable for portable audio devices.

Maximum Seated Height: 0.85 mm

The low seated height enables the audio codec to be used in slim and compact electronic devices.

Width: 5 mm

The narrow width of the audio codec allows for easy integration into various electronic devices without occupying much space.

Length: 5 mm

The short length of the audio codec contributes to its compact design and enables it to fit in small electronic devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the audio codec energy efficient and reliable.

Nominal Supply Voltage: 2.8 V

The low supply voltage requirement of 2.8 V enhances the energy efficiency of the audio codec and is suitable for battery-operated devices.

Terminal Pitch: 0.4 mm

The small terminal pitch allows for high-density mounting on PCBs, making this audio codec suitable for compact electronic devices.

Filter: YES

The presence of a filter helps in reducing noise and distortion in the audio signal, ensuring high-quality sound output.

Technical Specifications

Audio Codecs LC07424LP attributes and parameters. Explore more Audio Codecs devices from Onsemi

Specs

Filter:

YES

JESD-30 Code:

S-XQCC-N40

Length:

5 mm

No. of Functions:

1

No. of Terminals:

40

Operating Mode:

SYNCHRONOUS

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.85 mm

Nominal Supply Voltage:

2.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

LC07424LP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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