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TP3064V

Texas Instruments

TP3064V by Texas Instruments

TP3064V by Texas Instruments is a 20-terminal PCM CODEC chip carrier with synchronous/asynchronous operation. It features companding law MU-LAW, operates at -5V to 5V, and has a temperature range of 0-70°C. Ideal for audio applications requiring filter technology in commercial-grade telecom ICs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,995 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,995

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Digiode

USA . 4,531 parts In-Stock

1+ parts

-

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-

1k+ parts

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4,531

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Anansix

USA . 2,851 parts In-Stock

1+ parts

-

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2,851

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,334 parts In-Stock

1+ parts

$7.699

100+ parts

-

1k+ parts

$8.228

10k+ parts

-

1,334

$7.699

-

$8.228

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ChromeModa Solutions

Germany . 2,184 parts In-Stock

1+ parts

$8.651

100+ parts

$7.094

1k+ parts

-

10k+ parts

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2,184

$8.651

$7.094

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IDEA Electronic Components Group

UK . 122 parts In-Stock

1+ parts

$8.651

100+ parts

$8.218

1k+ parts

$7.786

10k+ parts

-

122

$8.651

$8.218

$7.786

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AZTECH Wire

Italy . 694 parts In-Stock

1+ parts

$10.786

100+ parts

-

1k+ parts

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10k+ parts

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694

$10.786

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One Stop Electronics

USA . 1,483 parts In-Stock

1+ parts

$287.000

100+ parts

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10k+ parts

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1,483

$287.000

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Corphita

USA . 5,315 parts In-Stock

1+ parts

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5,315

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DigiPath Technology Company

USA . 2,144 parts In-Stock

1+ parts

-

100+ parts

$7.800

1k+ parts

-

10k+ parts

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2,144

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$7.800

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Overview

Enhance your audio experience with the TP3064V by Texas Instruments. As a leading manufacturer in audio codecs, Texas Instruments delivers superior quality and reliability. Perfect for a variety of applications, this PCM codec chip carrier offers synchronous/asynchronous operation and mu-law companding law for optimal performance. With a commercial temperature grade and 5V nominal supply voltage, the TP3064V provides customers with value, efficiency, and exceptional sound quality for all their audio needs. Upgrade your audio system today with the TP3064V from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring longevity and ease of handling.

Surface Mount: YES

Being surface mountable allows for easy installation on PCBs, saving space and simplifying assembly processes.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different system configurations and requirements.

No. of Terminals: 20

Having 20 terminals allows the codec to interface with various external components and peripherals, enabling versatile connectivity options.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even under challenging environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature guarantees operation in a wide range of temperatures, making the product suitable for diverse applications.

Technology: CMOS

Utilizing CMOS technology enhances power efficiency and allows for integration with other CMOS devices, optimizing overall system performance.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in many systems, ensuring compatibility and ease of integration.

Filter: YES

Inclusion of a filter helps in reducing noise and improving signal quality, resulting in clear and distortion-free audio output.

Technical Specifications

Audio Codecs TP3064V attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

S-PQCC-J20

Length:

8.89 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

4.57 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

TP3064V Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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