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STW5098BBLT/LF

STMicroelectronics

STW5098BBLT/LF by STMicroelectronics

STW5098BBLT/LF by STMicroelectronics is a compact audio codec featuring a 1.8V nominal voltage and operates in synchronous mode. With a very thin profile (1mm height) and 112 terminals, it’s ideal for telecom applications. It withstands temperatures from -30 °C to 85°C, ensuring reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,856

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-

-

-

Digiode

USA . 4,592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,592

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-

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Anansix

USA . 72 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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72

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,566 parts In-Stock

1+ parts

$12.327

100+ parts

-

1k+ parts

$11.094

10k+ parts

-

1,566

$12.327

-

$11.094

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MKK Technologies

India . 750 parts In-Stock

1+ parts

$23.180

100+ parts

-

1k+ parts

-

10k+ parts

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750

$23.180

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-

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DigiPath Technology Company

USA . 750 parts In-Stock

1+ parts

$23.180

100+ parts

-

1k+ parts

-

10k+ parts

-

750

$23.180

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-

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Corphita

USA . 4,260 parts In-Stock

1+ parts

-

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4,260

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Parana Technologies

USA . 2,226 parts In-Stock

1+ parts

-

100+ parts

$14.739

1k+ parts

-

10k+ parts

-

2,226

-

$14.739

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Overview

Elevate your audio experience with the STW5098BBLT/LF from STMicroelectronics! This advanced audio codec combines quality and performance, ensuring crystal-clear sound in various applications from telecommunications to consumer electronics. With STMicroelectronics' renowned commitment to innovation and reliability, you can trust this compact, efficient solution to deliver exceptional audio fidelity while optimizing space and energy. Discover the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and helps protect the internal components from environmental factors.

Surface Mount: YES

Surface mount technology allows for higher density placement of components, ideal for compact designs.

No. of Functions: 2

Having multiple functions in one package increases design flexibility and reduces board space requirements.

Package Shape: SQUARE

A square package shape optimizes space utilization on the PCB, enabling efficient layout.

Operating Mode: SYNCHRONOUS

Synchronous operation can lead to improved performance and reduced timing issues in digital circuits.

No. of Terminals: 112

A higher number of terminals allows for more connections and functionalities, making it suitable for complex applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array design allows for efficient thermal management and enhances electrical performance in compact spaces.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this codec can operate reliably in a variety of environments without overheating.

Minimum Operating Temperature: -30 °C

A low minimum operating temperature makes this codec suitable for use in cold environments, enhancing its versatility.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates better placement on PCBs for efficient signal integrity.

Maximum Seated Height: 1 mm

A low seated height contributes to a slimmer profile, making it easier to fit into low-profile electronic devices.

Width: 5 mm

Compact width allows for space-efficient designs in applications where PCB real estate is limited.

Maximum Time At Peak Reflow Temperature (s): 40

The ability to withstand up to 40 seconds at peak reflow temperature ensures reliability during manufacturing processes.

Peak Reflow Temperature °C: 260

A high peak reflow temperature means the codec can handle modern manufacturing techniques without damage.

Length: 5 mm

Short length facilitates integration into smaller circuits, making it suitable for various compact applications.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade indicates reliability across a broader range of temperatures, increasing versatility.

Terminal Form: BALL

Ball terminal form improves solderability and provides reliable connections on surface-mounted PCBs.

Telecom IC Type: PCM CODEC

As a PCM codec, this product is ideal for high-performance audio compression and transmission in telecom applications.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage ensures energy efficiency, making it suitable for battery-powered devices.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density designs and efficient space utilization in modern electronics.

Filter: YES

The inclusion of a filter provides better signal integrity, reducing noise and improving the overall audio quality.

Technical Specifications

Audio Codecs STW5098BBLT/LF attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Filter:

YES

JESD-30 Code:

S-PBGA-B112

Length:

5 mm

No. of Functions:

2

No. of Terminals:

112

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Trade Compliance

STW5098BBLT/LF Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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