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TP3054N-X

Texas Instruments

TP3054N-X by Texas Instruments

TP3054N-X by Texas Instruments is a PCM CODEC with 16 terminals, operating at -55 to 125°C. It features +-5V power supplies, companding law MU-LAW, and synchronous/asynchronous modes. Ideal for military telecom applications due to its compact size (18.805mm x 7.62mm x 5.08mm) and CMOS technology offering high gain tolerance (0.15dB).

Median Price

$6.720

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 75 parts In-Stock

1+ parts

$6.720

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$3.136

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75

$6.720

$3.136

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Vyrian

USA . 4,901 parts In-Stock

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Digiode

USA . 2,720 parts In-Stock

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2,720

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Anansix

USA . 922 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 75 parts In-Stock

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75

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Dan-Mar Components

USA . 75 parts In-Stock

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R&J Components

USA . 3 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,457 parts In-Stock

1+ parts

$7.395

100+ parts

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$7.886

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$7.395

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$7.886

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DigiPath Technology Company

USA . 2,103 parts In-Stock

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$8.143

100+ parts

$7.491

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$8.143

$7.491

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IDEA Electronic Components Group

UK . 496 parts In-Stock

1+ parts

$8.309

100+ parts

$7.894

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$7.478

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496

$8.309

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$7.478

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ChromeModa Solutions

Germany . 435 parts In-Stock

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$8.309

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$6.813

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$8.309

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AZTECH Wire

Italy . 337 parts In-Stock

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$10.745

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One Stop Electronics

USA . 660 parts In-Stock

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$11.000

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Corphita

USA . 4,325 parts In-Stock

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Overview

Experience superior audio quality with the TP3054N-X by Texas Instruments, a leading manufacturer in the industry. This advanced Audio Codec is perfect for a wide range of applications, offering unparalleled value and benefits to customers. Whether you're looking for synchronous or asynchronous operation, this product delivers exceptional performance with its compact design and reliable technology. Upgrade your audio experience with the TP3054N-X and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers high durability and reliability, making the codec suitable for long-term use in various environments.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Supports both synchronous and asynchronous operation modes, providing flexibility for different communication systems and protocols.

Power Supplies (V): +-5

Operates on a dual power supply of +-5V, ensuring stable and efficient performance.

No. of Terminals: 16

16 terminals allow for easy and secure connections, enhancing the overall functionality and usability of the codec.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures up to 125°C, making it suitable for demanding industrial or military applications.

Companding Law: MU-LAW

Utilizes mu-law companding, a non-linear quantization technique that optimizes signal-to-noise ratio and dynamic range in digital communications.

Technology: CMOS

Uses CMOS technology, known for its low power consumption, high speed, and compatibility with various digital systems.

Nominal Supply Voltage: 5 V

Requires a nominal supply voltage of 5V, which is a standard and widely available power source for easy integration into different applications.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54mm, the codec allows for easy insertion into standard through-hole PCBs, simplifying the assembly process.

Filter: YES

Incorporates a filter for signal processing, noise reduction, and frequency shaping, resulting in improved audio quality and performance.

Technical Specifications

Audio Codecs TP3054N-X attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

18.805 mm

Linear Coding:

NOT AVAILABLE

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

TP3054N-X Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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