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TLC32040MFKB

Texas Instruments

TLC32040MFKB by Texas Instruments

TLC32040MFKB by Texas Instruments is a 14-bit PCM CODEC with +-5V power supplies, operating from -55 to 125 °C. It features a ceramic chip carrier package style and is ideal for military-grade telecom applications requiring filtering capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,246 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,246

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Digiode

USA . 1,442 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,442

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,102 parts In-Stock

1+ parts

$7.659

100+ parts

-

1k+ parts

$8.183

10k+ parts

-

2,102

$7.659

-

$8.183

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DigiPath Technology Company

USA . 1,147 parts In-Stock

1+ parts

$8.434

100+ parts

$7.759

1k+ parts

-

10k+ parts

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1,147

$8.434

$7.759

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IDEA Electronic Components Group

UK . 2,352 parts In-Stock

1+ parts

$8.606

100+ parts

$8.176

1k+ parts

$7.745

10k+ parts

-

2,352

$8.606

$8.176

$7.745

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ChromeModa Solutions

Germany . 783 parts In-Stock

1+ parts

$8.606

100+ parts

$7.057

1k+ parts

-

10k+ parts

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783

$8.606

$7.057

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AZTECH Wire

Italy . 743 parts In-Stock

1+ parts

$10.410

100+ parts

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743

$10.410

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One Stop Electronics

USA . 1,487 parts In-Stock

1+ parts

$576.000

100+ parts

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1,487

$576.000

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Corphita

USA . 1,263 parts In-Stock

1+ parts

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1,263

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Overview

Experience crystal clear audio quality like never before with the TLC32040MFKB by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch products like this PCM CODEC that is perfect for a wide range of applications. From telecommunications to consumer electronics, this 14-BIT linear coding chip carrier offers unmatched performance and reliability. With a military-grade temperature grade and ceramic package body material, you can trust that this codec will exceed your expectations. Upgrade your audio systems today with the TLC32040MFKB and enjoy the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its durability and resistance to high temperatures, ensuring the product can withstand harsh environments.

Power Supplies (V): +-5

Allows for dual power supply operation, providing flexibility in powering the device.

No. of Terminals: 28

Having a higher number of terminals allows for more connectivity options and functionality within the device.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can perform reliably even in hot conditions.

Technology: CMOS

CMOS technology is known for its low power consumption and noise immunity, making the product efficient and reliable.

Technical Specifications

Audio Codecs TLC32040MFKB attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

JESD-30 Code:

S-XQCC-N28

Linear Coding:

14-BIT

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

+-5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Codecs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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