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TLC32044IFNR

Texas Instruments

TLC32044IFNR by Texas Instruments

TLC32044IFNR by Texas Instruments is an Audio Codec with 28 terminals, operating from -40 to 85°C. It supports synchronous/asynchronous modes and has a nominal voltage of 5V. Ideal for PCM codec applications in telecom, this chip carrier package is surface-mountable and features a filter.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,557 parts In-Stock

1+ parts

-

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7,557

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Digiode

USA . 2,152 parts In-Stock

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-

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2,152

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 409 parts In-Stock

1+ parts

$13.762

100+ parts

-

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-

409

$13.762

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Parana Technologies

USA . 1,852 parts In-Stock

1+ parts

$14.510

100+ parts

-

1k+ parts

$14.950

10k+ parts

-

1,852

$14.510

-

$14.950

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ChromeModa Solutions

Germany . 6,274 parts In-Stock

1+ parts

$16.303

100+ parts

$13.368

1k+ parts

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6,274

$16.303

$13.368

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IDEA Electronic Components Group

UK . 335 parts In-Stock

1+ parts

$16.303

100+ parts

$15.488

1k+ parts

$14.673

10k+ parts

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335

$16.303

$15.488

$14.673

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One Stop Electronics

USA . 742 parts In-Stock

1+ parts

$80.000

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742

$80.000

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Corphita

USA . 3,753 parts In-Stock

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3,753

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DigiPath Technology Company

USA . 2,209 parts In-Stock

1+ parts

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100+ parts

$14.699

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2,209

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$14.699

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Overview

Experience unparalleled audio quality with the TLC32044IFNR by Texas Instruments, a leading manufacturer in the industry. As a top-of-the-line Audio Codec, this product offers exceptional value and benefits for various applications. From seamless synchronous/asynchronous operation to a compact chip carrier package, this codec delivers premium sound performance while maintaining industrial-grade reliability. Elevate your audio experience with the TLC32044IFNR and discover the difference that Texas Instruments can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the audio codec, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and space.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Support for both synchronous and asynchronous operating modes increases the flexibility and compatibility of the audio codec.

No. of Terminals: 28

Having 28 terminals enables the audio codec to connect to various components and peripherals for enhanced functionality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this audio codec can withstand challenging environments and conditions.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures stable and consistent power supply for optimal performance.

Filter: YES

The inclusion of a filter helps to improve the audio quality by reducing noise and interference, enhancing the overall audio experience.

Technical Specifications

Audio Codecs TLC32044IFNR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

JESD-30 Code:

S-PQCC-J28

Length:

11.5062 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

40 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.5062 mm

Trade Compliance

TLC32044IFNR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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