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TLC32041CFN

Texas Instruments

TLC32041CFN by Texas Instruments

TLC32041CFN by Texas Instruments is a 14-bit PCM CODEC with +-5V supplies, operating from 0 to 70°C. It features synchronous/asynchronous modes and a quad terminal position in a square chip carrier package. Ideal for audio applications requiring precise linear coding and filtering capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,081 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,081

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Digiode

USA . 4,506 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,506

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,265 parts In-Stock

1+ parts

$5.950

100+ parts

-

1k+ parts

$6.730

10k+ parts

-

2,265

$5.950

-

$6.730

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DigiPath Technology Company

USA . 853 parts In-Stock

1+ parts

$6.551

100+ parts

-

1k+ parts

-

10k+ parts

-

853

$6.551

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-

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ChromeModa Solutions

Germany . 2,381 parts In-Stock

1+ parts

$6.685

100+ parts

$5.482

1k+ parts

-

10k+ parts

-

2,381

$6.685

$5.482

-

-

IDEA Electronic Components Group

UK . 1,920 parts In-Stock

1+ parts

$6.685

100+ parts

-

1k+ parts

$6.016

10k+ parts

-

1,920

$6.685

-

$6.016

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AZTECH Wire

Italy . 681 parts In-Stock

1+ parts

$9.630

100+ parts

-

1k+ parts

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10k+ parts

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681

$9.630

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One Stop Electronics

USA . 1,531 parts In-Stock

1+ parts

$342.000

100+ parts

-

1k+ parts

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10k+ parts

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1,531

$342.000

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Corphita

USA . 2,460 parts In-Stock

1+ parts

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100+ parts

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2,460

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Overview

Unlock the power of crystal-clear audio with the TLC32041CFN from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. Ideal for applications in audio codecs, this chip carrier package offers synchronous/asynchronous operation and 14-bit linear coding, providing seamless integration and high-performance results. With a commercial temperature grade and low power consumption, the TLC32041CFN delivers exceptional value and benefits to customers seeking superior audio solutions. Experience the difference with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that provides protection to the internal components of the codec.

Surface Mount: YES

Allows for easy and secure installation on PCBs, saving space and ensuring stable connections.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Supports multiple operating modes for flexible integration into various systems.

Power Supplies (V): +-5

Compatible with standard power supplies, ensuring easy power management.

No. of Terminals: 28

Sufficient terminals for connecting to other components and peripherals.

Package Style (Meter): CHIP CARRIER

Compact and efficient package style that optimizes space on PCBs.

Maximum Operating Temperature: 70 °C

Can operate in a wide range of temperature conditions, suitable for diverse applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and efficient performance.

Nominal Supply Voltage: 5 V

Standard voltage level that is commonly used in electronic circuits.

Filter: YES

Includes a filter to ensure clean and clear audio signal processing.

Technical Specifications

Audio Codecs TLC32041CFN attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

JESD-30 Code:

S-PQCC-J28

Length:

11.5062 mm

Linear Coding:

14-BIT

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Codecs

Maximum Supply Current:

35 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.5062 mm

Trade Compliance

TLC32041CFN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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