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TCM29C14AJW

Texas Instruments

TCM29C14AJW by Texas Instruments

TCM29C14AJW by Texas Instruments is an Audio Codec with 24 terminals, operating at +-5V. It features synchronous/asynchronous mode and A/MU-LAW companding law. Ideal for PCM CODEC applications in telecom, it has a package size of 15.24mm x 32.05mm x 5.715mm and operates b/w 0°C to 70°C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,497 parts In-Stock

1+ parts

-

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5,497

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Digiode

USA . 885 parts In-Stock

1+ parts

-

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-

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885

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 600 parts In-Stock

1+ parts

$5.753

100+ parts

-

1k+ parts

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600

$5.753

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Parana Technologies

USA . 443 parts In-Stock

1+ parts

$15.175

100+ parts

-

1k+ parts

$15.574

10k+ parts

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443

$15.175

-

$15.574

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DigiPath Technology Company

USA . 1,731 parts In-Stock

1+ parts

$16.710

100+ parts

$15.373

1k+ parts

-

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1,731

$16.710

$15.373

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IDEA Electronic Components Group

UK . 1,004 parts In-Stock

1+ parts

$17.051

100+ parts

$16.198

1k+ parts

$15.346

10k+ parts

-

1,004

$17.051

$16.198

$15.346

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ChromeModa Solutions

Germany . 220 parts In-Stock

1+ parts

$17.051

100+ parts

$13.982

1k+ parts

-

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220

$17.051

$13.982

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Ampacity Inc.

Singapore . 658 parts In-Stock

1+ parts

$471.000

100+ parts

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658

$471.000

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One Stop Electronics

USA . 1,649 parts In-Stock

1+ parts

$705.000

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1,649

$705.000

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Semicontronic

India . 602 parts In-Stock

1+ parts

$788.000

100+ parts

$768.300

1k+ parts

$764.360

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602

$788.000

$768.300

$764.360

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Corphita

USA . 2,032 parts In-Stock

1+ parts

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2,032

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Corohmni

South Africa . 333 parts In-Stock

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333

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Overview

Enhance your audio experience with the TCM29C14AJW by Texas Instruments, a top-quality Audio Codec designed to deliver exceptional sound performance. With a reputation for excellence in manufacturing, Texas Instruments ensures reliability and innovation in every product they produce. This versatile codec is perfect for a wide range of applications, providing clear and crisp audio output. Experience the value and benefits of this innovative technology, offering customers unparalleled advantages and enhancing their overall audio experience. Elevate your sound quality with the TCM29C14AJW today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed body material ensures durability and reliability, making it suitable for various applications.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Flexible operating modes allow for seamless integration into different systems and communication protocols.

Power Supplies (V): +-5

Wide power supply voltage range makes it versatile and compatible with different power sources.

Temperature Grade: COMMERCIAL

Designed for commercial applications, ensuring stable performance within specified temperature ranges.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency.

Technical Specifications

Audio Codecs TCM29C14AJW attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-GDIP-T24

Length:

32.05 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

24

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

5.715 mm

Sub-Category:

Codecs

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

TCM29C14AJW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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