Loading...

S3507AI-CLCCD

Onsemi

S3507AI-CLCCD by Onsemi

S3507AI-CLCCD by Onsemi is a PCM CODEC chip carrier with 28 terminals. Operating in synchronous mode, it has a companding law of MU-LAW and operates b/w -40 to 85 °C. Ideal for telecom applications requiring audio codecs in industrial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,647 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,647

-

-

-

-

Vyrian

USA . 91 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

91

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 6,309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,309

-

-

-

-

Problanco Electronics

Mexico . 4,103 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,103

-

-

-

-

TANS Electronics

Latvia . 3,089 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,089

-

-

-

-

Kulean Microsystems

USA . 2,958 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,958

-

-

-

-

Corphita

USA . 831 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

831

-

-

-

-

Corohmni

South Africa . 168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

168

-

-

-

-

UHIMA Technologies

Türkiye . 162 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

162

-

-

-

-

Overview

Experience top-notch audio quality with the S3507AI-CLCCD by Onsemi, a leading manufacturer in the industry. Designed to meet the demands of various applications in the audio codecs category, this product offers exceptional value and benefits to customers. With a focus on quality and reliability, Onsemi's S3507AI-CLCCD provides seamless functionality and performance, making it the ideal choice for your audio codec needs. Unlock a world of possibilities and elevate your audio experience with this innovative product.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides durability and reliable performance, making this product suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and space during assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate data transmission and reception, making this audio codec ideal for applications where timing and synchronization are crucial.

No. of Terminals: 28

The large number of terminals allows for versatile connectivity options, accommodating a wide range of input and output configurations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this codec can withstand elevated temperatures, making it suitable for industrial environments.

Nominal Supply Voltage: 5 V

The 5V supply voltage ensures compatibility with standard power sources, making integration into existing systems seamless.

Technical Specifications

Audio Codecs S3507AI-CLCCD attributes and parameters. Explore more Audio Codecs devices from Onsemi

Specs

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

S-CQCC-N28

Length:

11.4935 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.159 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4935 mm

Trade Compliance

S3507AI-CLCCD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 14