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TP3070V-XG/NOPB

Texas Instruments

TP3070V-XG/NOPB by Texas Instruments

TP3070V-XG/NOPB by Texas Instruments is a 28-terminal audio codec with +-5V power supplies, operating in synchronous mode. With A/MU-LAW companding law and 245°C peak reflow temperature, it's ideal for industrial telecom applications requiring high-quality audio processing. The chip carrier package style and compact dimensions make it suitable for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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9,550

-

-

-

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Anansix

USA . 2,176 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,176

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-

-

-

Digiode

USA . 1,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,300

-

-

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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100

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,173 parts In-Stock

1+ parts

$8.216

100+ parts

-

1k+ parts

$8.829

10k+ parts

-

1,173

$8.216

-

$8.829

-

ChromeModa Solutions

Germany . 3,313 parts In-Stock

1+ parts

$9.232

100+ parts

$7.570

1k+ parts

-

10k+ parts

-

3,313

$9.232

$7.570

-

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IDEA Electronic Components Group

UK . 1,800 parts In-Stock

1+ parts

$9.232

100+ parts

$8.770

1k+ parts

$8.309

10k+ parts

-

1,800

$9.232

$8.770

$8.309

-

AZTECH Wire

Italy . 438 parts In-Stock

1+ parts

$13.776

100+ parts

-

1k+ parts

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10k+ parts

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438

$13.776

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-

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Corohmni

South Africa . 394 parts In-Stock

1+ parts

$14.567

100+ parts

-

1k+ parts

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10k+ parts

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394

$14.567

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Component Stockers USA

USA . 746 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

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746

$99.990

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One Stop Electronics

USA . 378 parts In-Stock

1+ parts

$747.000

100+ parts

-

1k+ parts

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10k+ parts

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378

$747.000

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-

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Ampacity Inc.

Singapore . 607 parts In-Stock

1+ parts

$875.000

100+ parts

-

1k+ parts

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10k+ parts

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607

$875.000

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-

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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15,000

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-

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A-Z Elektronik GmbH

Germany . 7,202 parts In-Stock

1+ parts

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100+ parts

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7,202

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Continental Prestige Electronics

USA . 5,706 parts In-Stock

1+ parts

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100+ parts

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5,706

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Argo Parts USA

USA . 4,620 parts In-Stock

1+ parts

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4,620

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Corphita

USA . 3,837 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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3,837

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-

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DigiPath Technology Company

USA . 2,122 parts In-Stock

1+ parts

-

100+ parts

$8.324

1k+ parts

-

10k+ parts

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2,122

-

$8.324

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-

Perfect Parts

USA . 648 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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648

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Microchip USA

USA . 411 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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411

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Aranea Global

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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50

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-

Overview

Experience crystal clear audio quality like never before with the TP3070V-XG/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch audio codecs that are perfect for a wide range of applications. Whether you're looking to enhance your sound system at home or improve communication devices in the workplace, this chip carrier package offers unmatched value and benefits. Trust in the reliability of Texas Instruments and take your audio experience to the next level with the TP3070V-XG/NOPB.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and lightweight design.

Surface Mount:

YES - Facilitates easy and secure installation on circuit boards.

Package Shape:

SQUARE - Allows for efficient use of space on PCBs.

Operating Mode:

SYNCHRONOUS - Ensures precise synchronization of audio signals.

Power Supplies (V):

+-5 - Compatible with standard power sources for seamless integration.

No. of Terminals:

28 - Offers versatile connection options for various applications.

Package Style (Meter):

CHIP CARRIER - Enhances thermal performance and reliability.

Maximum Operating Temperature:

85 °C - Suitable for operation in harsh environments.

Minimum Operating Temperature:

40 °C - Ensures functionality in extreme cold conditions.

Terminal Finish:

MATTE TIN - Provides corrosion resistance for longevity.

Terminal Position:

QUAD - Facilitates easy routing of connections on the PCB.

Maximum Seated Height:

4.57 mm - Allows for compact designs in space-constrained applications.

Width:

11.43 mm - Fits easily within standard PCB layouts.

Companding Law:

A/MU-LAW - Offers high-quality audio compression and expansion.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures reliable soldering during assembly.

Peak Reflow Temperature °C:

245 - Enables safe and efficient soldering process.

Length:

11.43 mm - Provides consistent dimensions for easy integration.

Temperature Grade:

INDUSTRIAL - Suitable for rugged industrial applications.

Technology:

CMOS - Delivers efficient performance with low power consumption.

Nominal Negative Supply Voltage:

5 V - Supports the required voltage for operation.

Terminal Form:

J BEND - Facilitates easy insertion into PCB mounting holes.

Maximum Supply Current:

0.013 mA - Ensures low power consumption for energy efficiency.

Telecom IC Type:

PROGRAMMABLE CODEC - Allows for customization and versatility in audio processing.

Nominal Supply Voltage:

5 V - Compatible with standard power sources for seamless integration.

Terminal Pitch:

1.27 mm - Allows for precise alignment and connection on PCBs.

Maximum Gain Tolerance:

0.15 dB - Ensures accurate and consistent audio signal amplification.

Moisture Sensitivity Level (MSL):

3 - Resistant to moisture damage during storage and operation.

Filter:

YES - Provides noise reduction and signal clarity for enhanced audio quality.

Technical Specifications

Audio Codecs TP3070V-XG/NOPB attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.43 mm

Linear Coding:

NOT AVAILABLE

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Codecs

Maximum Supply Current:

.013 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11.43 mm

Trade Compliance

TP3070V-XG/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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