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TLV320AIC3206IYZFR

Texas Instruments

TLV320AIC3206IYZFR by Texas Instruments

TLV320AIC3206IYZFR by Texas Instruments is a 42-terminal audio codec with synchronous operation. It features a nominal voltage of 1.8V, operates in industrial temperature grade range (-40 to 85°C), and supports PCM encoding/decoding for telecom applications. The package style is grid array with very thin profile and fine pitch, suitable for surface mount assembly.

Median Price

$5.016

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 205 parts In-Stock

1+ parts

$5.016

100+ parts

$2.357

1k+ parts

$2.257

10k+ parts

-

205

$5.016

$2.357

$2.257

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Sensible Micro Corp

USA . 12,995 parts In-Stock

1+ parts

-

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12,995

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Vyrian

USA . 4,698 parts In-Stock

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4,698

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Digiode

USA . 938 parts In-Stock

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938

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Microfarads

USA . 198 parts In-Stock

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198

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,711 parts In-Stock

1+ parts

$6.160

100+ parts

-

1k+ parts

$6.929

10k+ parts

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1,711

$6.160

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$6.929

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DigiPath Technology Company

USA . 1,695 parts In-Stock

1+ parts

$6.783

100+ parts

$6.240

1k+ parts

-

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1,695

$6.783

$6.240

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ChromeModa Solutions

Germany . 2,712 parts In-Stock

1+ parts

$6.921

100+ parts

$5.675

1k+ parts

-

10k+ parts

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2,712

$6.921

$5.675

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IDEA Electronic Components Group

UK . 568 parts In-Stock

1+ parts

$6.921

100+ parts

-

1k+ parts

$6.229

10k+ parts

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568

$6.921

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$6.229

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AZTECH Wire

Italy . 519 parts In-Stock

1+ parts

$11.156

100+ parts

-

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519

$11.156

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Component Stockers USA

USA . 1,574 parts In-Stock

1+ parts

$47.180

100+ parts

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1,574

$47.180

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One Stop Electronics

USA . 1,025 parts In-Stock

1+ parts

$417.000

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1,025

$417.000

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Corphita

USA . 3,267 parts In-Stock

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3,267

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QUARKTWIN TECHNOLOGY LTD

USA . 2,439 parts In-Stock

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2,439

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Overview

Experience the superior audio quality and innovative technology of the TLV320AIC3206IYZFR by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge solutions that exceed expectations. The TLV320AIC3206IYZFR is a versatile audio codec perfect for a wide range of applications. With its compact design and reliable performance, this product offers customers exceptional value and unparalleled benefits. Upgrade your audio experience with the TLV320AIC3206IYZFR and discover the difference that Texas Instruments can make in your projects.

Feature Benefit Bullets

Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and synchronization between components, resulting in high-quality audio output.

No. of Channels: 2

Dual channels provide stereo sound output, enhancing the audio experience for the user.

Nominal Supply Voltage: 1.8V

Low power consumption at a nominal supply voltage of 1.8V, making it energy efficient.

Terminal Finish: TIN SILVER COPPER

High-quality terminal finish ensures better conductivity and reliability for consistent audio performance.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature ranges, ensuring durability and reliability in various operating environments.

Technical Specifications

Audio Codecs TLV320AIC3206IYZFR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

R-PBGA-B42

JESD-609 Code:

e1

Length:

3.469 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

42

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

VOLTAGE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.269 mm

Trade Compliance

TLV320AIC3206IYZFR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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