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TP11368N

Texas Instruments

TP11368N by Texas Instruments

TP11368N by Texas Instruments is an Audio Codec with 24 terminals, operating in synchronous mode. It features companding law A/MU-LAW and supports ADPCM codec type for telecom applications. With a temperature range of -40 to 85°C, it is ideal for industrial use in various audio processing systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,376 parts In-Stock

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8,376

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Anansix

USA . 1,786 parts In-Stock

1+ parts

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1,786

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Digiode

USA . 1,537 parts In-Stock

1+ parts

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1,537

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Zilex Electronics Inc.

Canada . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 741 parts In-Stock

1+ parts

$5.886

100+ parts

-

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741

$5.886

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Parana Technologies

USA . 2,168 parts In-Stock

1+ parts

$11.908

100+ parts

-

1k+ parts

$12.307

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2,168

$11.908

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$12.307

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DigiPath Technology Company

USA . 567 parts In-Stock

1+ parts

$13.112

100+ parts

$12.063

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567

$13.112

$12.063

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IDEA Electronic Components Group

UK . 1,744 parts In-Stock

1+ parts

$13.380

100+ parts

$12.711

1k+ parts

$12.042

10k+ parts

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1,744

$13.380

$12.711

$12.042

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ChromeModa Solutions

Germany . 388 parts In-Stock

1+ parts

$13.380

100+ parts

$10.972

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388

$13.380

$10.972

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One Stop Electronics

USA . 495 parts In-Stock

1+ parts

$707.000

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495

$707.000

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Corphita

USA . 1,732 parts In-Stock

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1,732

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Overview

Experience unparalleled audio quality with the TP11368N by Texas Instruments, a leading manufacturer in the industry. This Audio Codec is ideal for a wide range of applications, providing crystal-clear sound and reliable performance. With its industrial-grade temperature grade and compact design, this codec offers unmatched value and benefits to customers. Elevate your audio experience with the TP11368N and enjoy the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and reliability, making the product suitable for long-term use.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and synchronized data transmission, enhancing the overall performance of the product.

No. of Terminals: 24

Having a higher number of terminals allows for more connectivity options, making the product versatile and adaptable to different systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can function efficiently even in challenging environmental conditions.

Companding Law: A/MU-LAW

A/MU-law companding law ensures high-quality audio processing and compression, resulting in clear and accurate sound output.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making the product easy to integrate into existing systems.

Technical Specifications

Audio Codecs TP11368N attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

NO

JESD-30 Code:

R-PDIP-T24

Length:

31.915 mm

No. of Functions:

1

No. of Terminals:

24

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.334 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TP11368N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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