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TLV320AIC25IPFBRG4

Texas Instruments

TLV320AIC25IPFBRG4 by Texas Instruments

TLV320AIC25IPFBRG4 by Texas Instruments is a 48-terminal audio codec with 2 channels. It operates in industrial temperature range, with 1.8-3.3V power supplies and supports single-ended/differential input type. Ideal for telecom applications due to its programmable nature and two's complement output code.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,428 parts In-Stock

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Digiode

USA . 4,841 parts In-Stock

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4,841

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Distributors (Availability)

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AZTECH Wire

Italy . 894 parts In-Stock

1+ parts

$7.936

100+ parts

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894

$7.936

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Parana Technologies

USA . 389 parts In-Stock

1+ parts

$15.838

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-

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$16.198

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389

$15.838

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$16.198

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DigiPath Technology Company

USA . 477 parts In-Stock

1+ parts

$17.440

100+ parts

$16.045

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477

$17.440

$16.045

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ChromeModa Solutions

Germany . 1,604 parts In-Stock

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$17.796

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$14.593

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1,604

$17.796

$14.593

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IDEA Electronic Components Group

UK . 438 parts In-Stock

1+ parts

$17.796

100+ parts

$16.906

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$16.016

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438

$17.796

$16.906

$16.016

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Component Stockers USA

USA . 486 parts In-Stock

1+ parts

$99.990

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486

$99.990

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Ampacity Inc.

Singapore . 1,300 parts In-Stock

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$129.000

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$129.000

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One Stop Electronics

USA . 603 parts In-Stock

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$130.000

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603

$130.000

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Semicontronic

India . 1,397 parts In-Stock

1+ parts

$320.000

100+ parts

$312.000

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$310.400

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1,397

$320.000

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$310.400

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Corphita

USA . 3,469 parts In-Stock

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3,469

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Microchip USA

USA . 120 parts In-Stock

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Corohmni

South Africa . 57 parts In-Stock

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Overview

Enhance your audio experience with the TLV320AIC25IPFBRG4 by Texas Instruments, a leading manufacturer in the industry. This Audio Codec offers unparalleled quality and reliability, perfect for a wide range of applications. Whether you're looking to improve the sound quality of your devices or enhance your audio processing capabilities, this product delivers exceptional value and performance. Upgrade your audio solutions today with the TLV320AIC25IPFBRG4 and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protects the internal components of the audio codec.

Surface Mount: YES

Being surface mountable makes it easy to integrate this audio codec into various electronic devices.

Output Code: TWOS COMPLEMENT

The two's complement output code allows for accurate representation of both positive and negative values in digital form.

Package Shape: SQUARE

The square package shape helps in efficient utilization of PCB space when designing the circuit.

No. of Channels: 2

Having 2 channels allows for stereo sound processing, making it suitable for audio applications that require dual-channel output.

Technology: CMOS

The CMOS technology used in this codec offers low power consumption and high noise immunity, making it an efficient choice for audio processing.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8V helps in reducing power consumption and heat dissipation in the circuit.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade range, this codec is suitable for use in a wide range of industrial applications where temperature fluctuations are common.

Technical Specifications

Audio Codecs TLV320AIC25IPFBRG4 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V ANALOG SUPPLY

Maximum Analog Input:

3 V

Filter:

YES

Input Code:

TWOS COMPLEMENT

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Maximum Output Voltage:

2.35 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Resolution (um):

16

Maximum Seated Height:

1.2 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TLV320AIC25IPFBRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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