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TCM29C18DWR

Texas Instruments

TCM29C18DWR by Texas Instruments

TCM29C18DWR by Texas Instruments is a PCM CODEC with 16 terminals, operating from 0 to 70°C. It features MU-LAW companding law, -5V negative supply voltage, and 5V nominal voltage. Ideal for telecom applications, this small outline package codec offers synchronous/asynchronous operation in a compact rectangular shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,083 parts In-Stock

1+ parts

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4,083

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Digiode

USA . 3,556 parts In-Stock

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3,556

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,120 parts In-Stock

1+ parts

$14.992

100+ parts

-

1k+ parts

$15.416

10k+ parts

-

1,120

$14.992

-

$15.416

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AZTECH Wire

Italy . 813 parts In-Stock

1+ parts

$16.097

100+ parts

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813

$16.097

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DigiPath Technology Company

USA . 2,091 parts In-Stock

1+ parts

$16.508

100+ parts

$15.187

1k+ parts

-

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2,091

$16.508

$15.187

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ChromeModa Solutions

Germany . 6,188 parts In-Stock

1+ parts

$16.845

100+ parts

$13.813

1k+ parts

-

10k+ parts

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6,188

$16.845

$13.813

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IDEA Electronic Components Group

UK . 1,546 parts In-Stock

1+ parts

$16.845

100+ parts

$16.003

1k+ parts

$15.160

10k+ parts

-

1,546

$16.845

$16.003

$15.160

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Semicontronic

India . 1,418 parts In-Stock

1+ parts

$294.000

100+ parts

$286.650

1k+ parts

$285.180

10k+ parts

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1,418

$294.000

$286.650

$285.180

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One Stop Electronics

USA . 1,243 parts In-Stock

1+ parts

$589.000

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1,243

$589.000

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Ampacity Inc.

Singapore . 176 parts In-Stock

1+ parts

$720.000

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176

$720.000

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Corphita

USA . 947 parts In-Stock

1+ parts

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947

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Corohmni

South Africa . 391 parts In-Stock

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391

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Overview

Enhance your audio experience with the TCM29C18DWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality audio codecs that are perfect for a wide range of applications. Whether you're designing a new sound system or upgrading an existing one, this product offers unmatched value and benefits. With its compact design and advanced technology, the TCM29C18DWR provides crystal-clear audio performance, making it the perfect choice for all your audio needs. Trust Texas Instruments to deliver excellence in every product they create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, making the product space-efficient.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different applications.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and compatibility with various systems.

Maximum Operating Temperature: 70 °C

Operates efficiently in a wide range of temperatures, ensuring reliability in different environmental conditions.

Minimum Operating Temperature: 0 °C

Can function effectively even in low temperatures, making it suitable for diverse applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the product's performance and efficiency.

Nominal Supply Voltage: 5 V

Operates at a standard voltage level, ensuring compatibility with most electronic systems.

Technical Specifications

Audio Codecs TCM29C18DWR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TCM29C18DWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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