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TCM320AC36CDW

Texas Instruments

TCM320AC36CDW by Texas Instruments

Texas Instruments TCM320AC36CDW is a 20-terminal PCM CODEC with A-LAW companding law. Operating in synchronous/asynchronous mode, it has 13-bit linear coding and supports filter technology. Ideal for telecom applications, this small outline package has a max supply current of 7.5 mA and operates b/w 0-70°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,807 parts In-Stock

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Digiode

USA . 4,261 parts In-Stock

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Chip Stock

USA . 189 parts In-Stock

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Bristol Electronics

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SPM Sales

USA . 48 parts In-Stock

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Legend Electronics Inc.

USA . 25 parts In-Stock

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R&J Components

USA . 22 parts In-Stock

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GES GmbH

Germany . 8 parts In-Stock

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Parana Technologies

USA . 760 parts In-Stock

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$1.202

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$1.998

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760

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$1.998

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DigiPath Technology Company

USA . 970 parts In-Stock

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$1.323

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$1.217

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ChromeModa Solutions

Germany . 6,865 parts In-Stock

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$1.350

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$1.107

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IDEA Electronic Components Group

UK . 1,927 parts In-Stock

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$1.350

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$1.215

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AZTECH Wire

Italy . 510 parts In-Stock

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$13.892

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510

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One Stop Electronics

USA . 1,117 parts In-Stock

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Kepictronics

USA . 33,240 parts In-Stock

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Lixinc

USA . 3,967 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,394 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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Overview

Enhance the audio quality of your products with the TCM320AC36CDW by Texas Instruments, a leading manufacturer in the industry. This Audio Codec offers seamless synchronous/asynchronous operation, compact small outline packaging, and A-Law companding law for optimal performance. Perfect for telecom applications, this PCM CODEC ensures clear, high-quality sound transmission with minimal supply current. Elevate your audio experience with Texas Instruments' cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, perfect for portable audio devices.

Surface Mount: YES

Being surface mountable makes it easier for manufacturers to integrate this audio codec into their PCB designs, saving space and reducing assembly costs.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different types of audio applications, ensuring compatibility with various systems.

No. of Terminals: 20

With 20 terminals, this audio codec offers a variety of connectivity options, allowing for versatile integration and functionality within audio systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact audio devices where size is a critical factor.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliability and stability even in challenging environmental conditions.

Width: 7.5 mm

The compact width of 7.5mm allows for placement in tight spaces, contributing to the overall efficiency of the audio device design.

Technology: CMOS

The CMOS technology used in this audio codec provides low power consumption and high noise immunity, resulting in optimal performance and efficiency.

Filter: YES

The inclusion of a filter enhances the audio quality by reducing noise and interference, ensuring clear and crisp sound output.

Technical Specifications

Audio Codecs TCM320AC36CDW attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TCM320AC36CDW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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