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TLVAIC3106IRGZRG4

Texas Instruments

TLVAIC3106IRGZRG4 by Texas Instruments

TLVAIC3106IRGZRG4 by Texas Instruments is a 48-terminal audio codec with synchronous operation. It features a package style of chip carrier, heat sink/slug, and very thin profile. Ideal for telecom applications requiring PCM encoding/decoding at industrial temperature grades up to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,463 parts In-Stock

1+ parts

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6,463

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Digiode

USA . 823 parts In-Stock

1+ parts

-

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-

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823

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 570 parts In-Stock

1+ parts

$7.376

100+ parts

-

1k+ parts

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570

$7.376

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Parana Technologies

USA . 2,063 parts In-Stock

1+ parts

$14.720

100+ parts

-

1k+ parts

$15.161

10k+ parts

-

2,063

$14.720

-

$15.161

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DigiPath Technology Company

USA . 2,195 parts In-Stock

1+ parts

$16.208

100+ parts

$14.912

1k+ parts

-

10k+ parts

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2,195

$16.208

$14.912

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ChromeModa Solutions

Germany . 2,584 parts In-Stock

1+ parts

$16.539

100+ parts

$13.562

1k+ parts

-

10k+ parts

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2,584

$16.539

$13.562

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IDEA Electronic Components Group

UK . 1,617 parts In-Stock

1+ parts

$16.539

100+ parts

$15.712

1k+ parts

$14.885

10k+ parts

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1,617

$16.539

$15.712

$14.885

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One Stop Electronics

USA . 725 parts In-Stock

1+ parts

$773.000

100+ parts

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725

$773.000

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Corphita

USA . 2,502 parts In-Stock

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2,502

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Overview

Experience crystal clear sound quality like never before with the TLVAIC3106IRGZRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch performance and reliability in their audio codecs. Ideal for a wide range of applications, this chip carrier codec offers seamless integration and superior functionality. Elevate your audio experience with this high-quality, innovative product that delivers exceptional value and unmatched benefits to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and allows for a lighter weight product.

Surface Mount: YES

Surface mounting allows for easy installation on PCBs, saving space and making production more efficient.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and coordination, leading to better overall performance.

Nominal Supply Voltage: 1.8 V

The low supply voltage requirement makes this audio codec an energy-efficient choice.

Filter: YES

The presence of a filter helps improve the quality of audio signal output, reducing noise and interference.

Technical Specifications

Audio Codecs TLVAIC3106IRGZRG4 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V ANALOG SUPPLY

Filter:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TLVAIC3106IRGZRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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