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TCM129C16N-00

Texas Instruments

TCM129C16N-00 by Texas Instruments

TCM129C16N-00 by Texas Instruments is an Audio Codec with 16 terminals, operating in synchronous mode. It features companding law MU-LAW and operates at industrial temperature grade. This PCM CODEC has a package size of 7.62mm x 19.305mm, suitable for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,725 parts In-Stock

1+ parts

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5,725

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Digiode

USA . 2,913 parts In-Stock

1+ parts

-

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-

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2,913

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 830 parts In-Stock

1+ parts

$7.666

100+ parts

-

1k+ parts

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830

$7.666

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-

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Parana Technologies

USA . 482 parts In-Stock

1+ parts

$10.834

100+ parts

-

1k+ parts

$11.313

10k+ parts

-

482

$10.834

-

$11.313

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DigiPath Technology Company

USA . 762 parts In-Stock

1+ parts

$11.930

100+ parts

$10.975

1k+ parts

-

10k+ parts

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762

$11.930

$10.975

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ChromeModa Solutions

Germany . 6,503 parts In-Stock

1+ parts

$12.173

100+ parts

$9.982

1k+ parts

-

10k+ parts

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6,503

$12.173

$9.982

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IDEA Electronic Components Group

UK . 1,574 parts In-Stock

1+ parts

$12.173

100+ parts

$11.564

1k+ parts

$10.956

10k+ parts

-

1,574

$12.173

$11.564

$10.956

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One Stop Electronics

USA . 370 parts In-Stock

1+ parts

$714.000

100+ parts

-

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10k+ parts

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370

$714.000

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Corphita

USA . 2,662 parts In-Stock

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2,662

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Overview

Experience superior audio quality with the TCM129C16N-00 by Texas Instruments, a leading manufacturer in the industry. This Audio Codec offers unparalleled value and benefits for a wide range of applications, providing seamless audio processing and exceptional sound performance. Its industrial-grade construction ensures reliable operation in various environments, making it the ideal choice for your audio codec needs. Unlock the potential of your audio projects with the TCM129C16N-00 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material ensures durability and resistance to external elements, making this product suitable for various environments.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and reliable data transmission, contributing to high-quality audio output.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options, enabling easy integration into different audio systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable performance even in harsh environments, making it suitable for industrial applications.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage ensures consistent and optimal performance of the audio codec.

Filter: YES

The presence of a filter helps in reducing noise and interference, resulting in clear and distortion-free audio output.

Technical Specifications

Audio Codecs TCM129C16N-00 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM129C16N-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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