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TCM129C17N

Texas Instruments

TCM129C17N by Texas Instruments

TCM129C17N by Texas Instruments is an Audio Codec with A-LAW companding law, operating at +-5V. It features 16 terminals in a rectangular package style for synchronous operation. Ideal for telecom applications requiring PCM CODEC technology in industrial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,875 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,875

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Digiode

USA . 664 parts In-Stock

1+ parts

-

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-

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664

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,847 parts In-Stock

1+ parts

$8.594

100+ parts

-

1k+ parts

$9.257

10k+ parts

-

1,847

$8.594

-

$9.257

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ChromeModa Solutions

Germany . 6,838 parts In-Stock

1+ parts

$9.656

100+ parts

$7.918

1k+ parts

-

10k+ parts

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6,838

$9.656

$7.918

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IDEA Electronic Components Group

UK . 1,587 parts In-Stock

1+ parts

$9.656

100+ parts

$9.173

1k+ parts

$8.690

10k+ parts

-

1,587

$9.656

$9.173

$8.690

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AZTECH Wire

Italy . 363 parts In-Stock

1+ parts

$19.184

100+ parts

-

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363

$19.184

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Semicontronic

India . 1,152 parts In-Stock

1+ parts

$519.000

100+ parts

$506.025

1k+ parts

$503.430

10k+ parts

-

1,152

$519.000

$506.025

$503.430

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One Stop Electronics

USA . 839 parts In-Stock

1+ parts

$519.000

100+ parts

-

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10k+ parts

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839

$519.000

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Ampacity Inc.

Singapore . 970 parts In-Stock

1+ parts

$792.000

100+ parts

-

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970

$792.000

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Corphita

USA . 4,634 parts In-Stock

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4,634

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DigiPath Technology Company

USA . 1,118 parts In-Stock

1+ parts

-

100+ parts

$8.706

1k+ parts

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10k+ parts

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1,118

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$8.706

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Corohmni

South Africa . 297 parts In-Stock

1+ parts

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297

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Overview

Enhance your audio experience with the TCM129C17N by Texas Instruments, a top-of-the-line PCM CODEC designed to deliver unparalleled sound quality in a compact package. With Texas Instruments' reputation for excellence in audio technology, this innovative product is perfect for a wide range of applications. Whether you're a professional in the telecommunications industry or an audio enthusiast looking to upgrade your equipment, this versatile codec offers exceptional value, superior performance, and precise functionality. Elevate your audio projects with the TCM129C17N and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and reliable data transmission.

Power Supplies (V): +-5

Dual power supplies provide stable voltage for optimal performance.

No. of Terminals: 16

Sufficient number of terminals for connectivity and functionality.

Package Style (Meter): IN-LINE

In-line package style saves space and allows for easy integration in circuit designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Companding Law: A-LAW

A-Law companding law provides high-quality audio compression for clear sound.

Technology: CMOS

CMOS technology offers low power consumption and high integration capabilities.

Nominal Supply Voltage: 5 V

Standard supply voltage for compatibility with other devices.

Filter: YES

Built-in filter ensures noise-free audio output.

Technical Specifications

Audio Codecs TCM129C17N attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

.08 dB

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TCM129C17N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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