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TCM29C14JW-00

Texas Instruments

TCM29C14JW-00 by Texas Instruments

Texas Instruments TCM29C14JW-00 is an Audio Codec with 24 terminals, operating in asynchronous mode. It features A/MU-LAW companding law, -5V negative supply voltage, and 5V nominal voltage. Ideal for PCM CODEC applications in telecom ICs due to its compact rectangular package design and commercial temperature grade suitability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,036 parts In-Stock

1+ parts

-

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5,036

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Digiode

USA . 4,744 parts In-Stock

1+ parts

-

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4,744

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,277 parts In-Stock

1+ parts

$7.350

100+ parts

-

1k+ parts

$7.843

10k+ parts

-

2,277

$7.350

-

$7.843

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AZTECH Wire

Italy . 732 parts In-Stock

1+ parts

$7.753

100+ parts

-

1k+ parts

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10k+ parts

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732

$7.753

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DigiPath Technology Company

USA . 2,039 parts In-Stock

1+ parts

$8.093

100+ parts

$7.445

1k+ parts

-

10k+ parts

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2,039

$8.093

$7.445

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ChromeModa Solutions

Germany . 1,663 parts In-Stock

1+ parts

$8.258

100+ parts

$6.772

1k+ parts

-

10k+ parts

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1,663

$8.258

$6.772

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IDEA Electronic Components Group

UK . 869 parts In-Stock

1+ parts

$8.258

100+ parts

-

1k+ parts

$7.432

10k+ parts

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869

$8.258

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$7.432

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One Stop Electronics

USA . 427 parts In-Stock

1+ parts

$240.000

100+ parts

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10k+ parts

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427

$240.000

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Corphita

USA . 945 parts In-Stock

1+ parts

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945

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Overview

Unleash the power of crystal-clear audio with the TCM29C14JW-00 by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability. This audio codec is perfect for a wide range of applications, from telecommunications to consumer electronics. Elevate your audio experience with the TCM29C14JW-00, offering unmatched value and benefits to customers seeking superior sound performance.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed materials ensures durability and reliability, making the product suitable for various operating conditions.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for flexibility in data transmission, making it ideal for applications where timing variations may occur.

No. of Terminals: 24

With 24 terminals, this product offers a high level of connectivity, enabling it to handle complex audio processing tasks effectively.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance of 70°C ensures stable performance even in temperature-varying environments.

Companding Law: A/MU-LAW

The A/MU-Law companding law allows for efficient compression and expansion of audio signals, resulting in improved signal-to-noise ratio and overall audio quality.

Technical Specifications

Audio Codecs TCM29C14JW-00 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-GDIP-T24

Length:

32.05 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

24

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.715 mm

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

TCM29C14JW-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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