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TLV320AC37IPT

Texas Instruments

TLV320AC37IPT by Texas Instruments

TLV320AC37IPT by Texas Instruments is a 48-terminal audio codec with 13-bit linear coding and A-LAW companding law. Operating at 3V, it has a max supply current of 7.5mA and operates in industrial temperature grade. Ideal for PCM codec applications in telecom due to its compact flatpack design and fine pitch package style.

Median Price

$9.841

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$9.841

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$9.841

-

-

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Vyrian

USA . 7,361 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,361

-

-

-

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Digiode

USA . 367 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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367

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ECAB

Sweden . 10 parts In-Stock

1+ parts

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,334 parts In-Stock

1+ parts

$7.741

100+ parts

-

1k+ parts

$8.276

10k+ parts

-

1,334

$7.741

-

$8.276

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AZTECH Wire

Italy . 407 parts In-Stock

1+ parts

$8.516

100+ parts

-

1k+ parts

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407

$8.516

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-

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DigiPath Technology Company

USA . 1,609 parts In-Stock

1+ parts

$8.524

100+ parts

-

1k+ parts

-

10k+ parts

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1,609

$8.524

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-

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ChromeModa Solutions

Germany . 5,411 parts In-Stock

1+ parts

$8.698

100+ parts

$7.132

1k+ parts

-

10k+ parts

-

5,411

$8.698

$7.132

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IDEA Electronic Components Group

UK . 1,591 parts In-Stock

1+ parts

$8.698

100+ parts

$8.263

1k+ parts

$7.828

10k+ parts

-

1,591

$8.698

$8.263

$7.828

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One Stop Electronics

USA . 1,380 parts In-Stock

1+ parts

$526.000

100+ parts

-

1k+ parts

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1,380

$526.000

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Corphita

USA . 3,425 parts In-Stock

1+ parts

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3,425

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Overview

Upgrade your audio experience with the Texas Instruments TLV320AC37IPT Audio Codec. Manufactured by industry leader Texas Instruments, this codec offers top-notch quality and reliability. Perfect for a wide range of applications in the audio industry, this codec provides exceptional value and benefits to customers looking for high-performance sound solutions. Trust Texas Instruments to deliver outstanding results with the TLV320AC37IPT Audio Codec.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the audio codec.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and simplifying assembly.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Offers flexibility in how the codec can be implemented and used in various audio applications.

Power Supplies (V): 3

Operates efficiently with a common voltage supply, facilitating integration into existing systems.

No. of Terminals: 48

Provides a sufficient number of connections for interfacing with other components and peripherals.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in elevated temperature environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold conditions, making it versatile for various operating environments.

Linear Coding: 13-BIT

Offers high resolution and accurate encoding of audio signals for clear and precise output.

Technology: CMOS

Utilizes efficient and low-power CMOS technology for optimized performance and energy efficiency.

Telecom IC Type: PCM CODEC

Specifically designed for telecommunication applications, providing high-quality audio encoding and decoding capabilities.

Technical Specifications

Audio Codecs TLV320AC37IPT attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

2 dB

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

48

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Codecs

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TLV320AC37IPT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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