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TCM29C19N-10

Texas Instruments

TCM29C19N-10 by Texas Instruments

TCM29C19N-10 by Texas Instruments is an Audio Codec with 16 terminals, operating in synchronous mode. It has a companding law of MU-LAW and operates at temperatures b/w 0 to 70°C. This PCM CODEC is commonly used in telecom applications due to its compact rectangular package style and through-hole terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,886 parts In-Stock

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7,886

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Digiode

USA . 4,263 parts In-Stock

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4,263

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 886 parts In-Stock

1+ parts

$13.153

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886

$13.153

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Parana Technologies

USA . 1,269 parts In-Stock

1+ parts

$14.187

100+ parts

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$14.644

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1,269

$14.187

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$14.644

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ChromeModa Solutions

Germany . 4,800 parts In-Stock

1+ parts

$15.941

100+ parts

$13.072

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4,800

$15.941

$13.072

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IDEA Electronic Components Group

UK . 1,814 parts In-Stock

1+ parts

$15.941

100+ parts

$15.144

1k+ parts

$14.347

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1,814

$15.941

$15.144

$14.347

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One Stop Electronics

USA . 1,248 parts In-Stock

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$562.000

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$562.000

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DigiPath Technology Company

USA . 1,829 parts In-Stock

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$14.372

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1,829

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Corphita

USA . 1,317 parts In-Stock

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1,317

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Overview

Enhance your audio experience with the TCM29C19N-10 by Texas Instruments, a top-of-the-line Audio Codec designed to deliver unmatched quality and performance. As a leading manufacturer in the industry, Texas Instruments ensures reliability and innovation in every product they create. Perfect for a wide range of applications, this PCM CODEC offers seamless operation in synchronous mode, making it ideal for telecom needs. With its compact design and commercial-grade temperature tolerance, the TCM29C19N-10 guarantees superior functionality and value for all your audio processing requirements. Elevate your audio projects with this exceptional product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the internal components of the codec, ensuring longevity and reliability.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination between input and output signals, resulting in high-quality audio conversion.

No. of Terminals: 16

Having 16 terminals offers flexibility for connecting to various other components or circuitry, enabling versatile integration in different audio systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance of 70 °C ensures stable performance even in demanding environmental conditions.

Companding Law: MU-LAW

The use of MU-LAW companding law helps in achieving efficient compression and expansion of audio signals, leading to improved signal-to-noise ratio and dynamic range.

Technical Specifications

Audio Codecs TCM29C19N-10 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM29C19N-10 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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