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ETC5067N-X

STMicroelectronics

ETC5067N-X by STMicroelectronics

ETC5067N-X by STMicroelectronics is an Audio Codec with +-5V power supplies, 20 terminals, and A-LAW companding law. It operates in synchronous/asynchronous mode for PCM CODEC applications. Package style: IN-LINE, Technology: CMOS, Temperature Grade: INDUSTRIAL.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,396 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,396

-

-

-

-

Vyrian

USA . 2,375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,375

-

-

-

-

Anansix

USA . 879 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

879

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,789 parts In-Stock

1+ parts

$14.032

100+ parts

-

1k+ parts

$12.629

10k+ parts

-

1,789

$14.032

-

$12.629

-

MKK Technologies

India . 1,668 parts In-Stock

1+ parts

$26.386

100+ parts

-

1k+ parts

-

10k+ parts

-

1,668

$26.386

-

-

-

DigiPath Technology Company

USA . 1,668 parts In-Stock

1+ parts

$26.386

100+ parts

-

1k+ parts

-

10k+ parts

-

1,668

$26.386

-

-

-

Native Components

USA . 959 parts In-Stock

1+ parts

$106.770

100+ parts

-

1k+ parts

-

10k+ parts

$102.499

959

$106.770

-

-

$102.499

Northwest PG Solutions

USA . 1,920 parts In-Stock

1+ parts

$117.447

100+ parts

-

1k+ parts

-

10k+ parts

-

1,920

$117.447

-

-

-

Corphita

USA . 3,051 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,051

-

-

-

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Parana Technologies

USA . 306 parts In-Stock

1+ parts

-

100+ parts

$16.777

1k+ parts

-

10k+ parts

-

306

-

$16.777

-

-

Overview

Unlock the power of exceptional audio quality with the ETC5067N-X by STMicroelectronics. Designed with precision and expertise, this Audio Codec offers unparalleled performance in a wide range of applications. Whether you're looking to enhance your communication devices or improve sound clarity in your projects, this product delivers outstanding value and benefits. Trust in STMicroelectronics' reputation for top-notch manufacturing and elevate your audio experience with the ETC5067N-X.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, making it suitable for portable and long-lasting applications.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different system requirements, allowing for seamless integration into various setups.

Power Supplies (V): +-5

The wide power supply range of +-5V ensures compatibility with different power sources, making the product versatile and easy to integrate into existing systems.

No. of Terminals: 20

With 20 terminals, this product offers ample connectivity options, enabling it to handle complex audio codec functions effectively.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures the product can function reliably even in demanding industrial environments.

Technology: CMOS

The CMOS technology used in this audio codec ensures low power consumption and high integration, making it efficient and cost-effective for various applications.

Technical Specifications

Audio Codecs ETC5067N-X attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

25.15 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

3.93 mm

Sub-Category:

Codecs

Maximum Supply Current:

12 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

ETC5067N-X Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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