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TP3067BFNR

Texas Instruments

TP3067BFNR by Texas Instruments

TP3067BFNR by Texas Instruments is an Audio Codec with 20 terminals in a chip carrier package. Operating from 0 to 70°C, it supports synchronous/asynchronous modes and A-Law companding law. Ideal for telecom applications requiring PCM encoding/decoding with -5V/+5V supply voltage range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,229 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,229

-

-

-

-

Digiode

USA . 400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

400

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 241 parts In-Stock

1+ parts

$8.134

100+ parts

-

1k+ parts

-

10k+ parts

-

241

$8.134

-

-

-

Parana Technologies

USA . 615 parts In-Stock

1+ parts

$14.818

100+ parts

-

1k+ parts

$15.249

10k+ parts

-

615

$14.818

-

$15.249

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DigiPath Technology Company

USA . 74 parts In-Stock

1+ parts

$16.317

100+ parts

$15.012

1k+ parts

-

10k+ parts

-

74

$16.317

$15.012

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-

ChromeModa Solutions

Germany . 4,510 parts In-Stock

1+ parts

$16.650

100+ parts

$13.653

1k+ parts

-

10k+ parts

-

4,510

$16.650

$13.653

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IDEA Electronic Components Group

UK . 1,357 parts In-Stock

1+ parts

$16.650

100+ parts

$15.818

1k+ parts

$14.985

10k+ parts

-

1,357

$16.650

$15.818

$14.985

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One Stop Electronics

USA . 855 parts In-Stock

1+ parts

$202.000

100+ parts

-

1k+ parts

-

10k+ parts

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855

$202.000

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Corphita

USA . 1,004 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,004

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Overview

Enhance your audio systems with the TP3067BFNR by Texas Instruments, a top-quality Audio Codec designed to deliver unmatched sound performance. Texas Instruments, known for its excellence in semiconductor manufacturing, brings you a reliable and durable solution for your audio needs. This PCM CODEC is perfect for a wide range of applications, providing clear and crisp sound output. With its compact design and advanced features, the TP3067BFNR offers exceptional value and benefits to customers looking to elevate their audio experience. Upgrade your audio systems today with Texas Instruments' TP3067BFNR and immerse yourself in superior sound quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the internal components, ensuring durability and reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Package Shape: SQUARE

Square shape enables compact and space-saving design, making it suitable for various applications.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Support for both synchronous and asynchronous operation allows for flexibility in different system configurations.

No. of Terminals: 20

A higher number of terminals offer more connectivity options and functionality.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers easy integration and compatibility with modern electronic devices.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in demanding conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in various environments.

Terminal Position: QUAD

Quad terminal position provides stability and ease of connection.

Maximum Seated Height: 4.57 mm

Low maximum seated height enables compact and slim device designs.

Width: 8.9662 mm

Compact width makes the product suitable for small form factor applications.

Companding Law: A-LAW

A-Law companding law ensures high-quality audio signal processing.

Length: 8.9662 mm

Compact length complements the width, making the overall size compact.

Temperature Grade: COMMERCIAL

Commercial temperature grade is suitable for standard operating conditions.

Nominal Negative Supply Voltage: -5 V

Negative supply voltage support adds versatility to power supply options.

Terminal Form: J BEND

J Bend terminals offer secure and reliable connections.

Maximum Supply Current: 10 mA

Low maximum supply current consumption for energy-efficient operation.

Telecom IC Type: PCM CODEC

PCM codec type is commonly used in telecommunications for high-quality audio encoding and decoding.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage enables consistent performance.

Terminal Pitch: 1.27 mm

Optimal terminal pitch allows for easy soldering and connection.

Filter: YES

Integrated filter enhances audio signal processing and quality.

Technical Specifications

Audio Codecs TP3067BFNR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

JESD-30 Code:

S-PQCC-J20

Length:

8.9662 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.9662 mm

Trade Compliance

TP3067BFNR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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