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ETC5054D-X/H

STMicroelectronics

ETC5054D-X/H by STMicroelectronics

ETC5054D-X/H by STMicroelectronics is a compact PCM codec designed for audio applications, featuring synchronous/asynchronous operation and a 16-terminal gull-wing package. It operates b/w 0 °C to 70 °C with a nominal voltage of 5V. Ideal for telecom systems, it utilizes MU-LAW companding for efficient audio processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,476 parts In-Stock

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4,476

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Digiode

USA . 4,145 parts In-Stock

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4,145

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Anansix

USA . 991 parts In-Stock

1+ parts

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991

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Bristol Electronics

USA . 373 parts In-Stock

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373

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 500 parts In-Stock

1+ parts

$1.720

100+ parts

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500

$1.720

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Northwest PG Solutions

USA . 384 parts In-Stock

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$1.892

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384

$1.892

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Microchip USA

USA . 243 parts In-Stock

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$9.060

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243

$9.060

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IDEA Electronic Components Group

UK . 548 parts In-Stock

1+ parts

$16.114

100+ parts

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$14.502

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548

$16.114

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$14.502

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MKK Technologies

India . 994 parts In-Stock

1+ parts

$30.301

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994

$30.301

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DigiPath Technology Company

USA . 994 parts In-Stock

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$30.301

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994

$30.301

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QUARKTWIN TECHNOLOGY LTD

USA . 27,895 parts In-Stock

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27,895

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Corphita

USA . 4,894 parts In-Stock

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4,894

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Parana Technologies

USA . 816 parts In-Stock

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$19.266

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816

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$19.266

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Overview

Elevate your audio projects with the ETC5054D-X/H from STMicroelectronics—where exceptional quality meets innovative design. Renowned for their cutting-edge technology, STMicroelectronics delivers a robust PCM codec that enhances sound clarity in telecommunications and multimedia applications. With its compact form and versatile operating modes, this product ensures seamless integration while providing unmatched reliability and performance. Experience superior audio today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern circuit boards.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB while providing a stable mounting solution.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The flexibility of both synchronous and asynchronous operating modes makes this codec versatile for different audio signal processing needs.

No. of Terminals: 16

With 16 terminals, this codec provides ample connections for various audio signal inputs and outputs, enhancing its functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for efficient use of board space, essential for compact electronic devices.

Maximum Operating Temperature: 70 °C

Operating at high temperatures up to 70 °C ensures reliability and performance in demanding environments.

Minimum Operating Temperature: 0 °C

The ability to function from 0 °C makes this codec suitable for a wide range of temperature conditions and applications.

Terminal Position: DUAL

The dual terminal position design aids in straightforward assembly and enhanced electrical performance.

Maximum Seated Height: 2.65 mm

With a low seated height, this codec supports low-profile designs that are desirable in modern electronics.

Width: 7.5 mm

The compact width facilitates easy integration into space-constrained designs.

Companding Law: MU-LAW

MU-LAW companding law is widely used in audio applications, ensuring compatibility and high-quality sound processing.

Length: 10.3 mm

The short length enables a compact footprint on the PCB, assisting in overall design efficiency.

Temperature Grade: COMMERCIAL

Rated for commercial temperature ranges, this codec is ideal for consumer electronics with expected high reliability.

Technology: CMOS

CMOS technology enhances performance efficiency and power consumption, making it suitable for battery-powered devices.

Nominal Negative Supply Voltage: -5 V

A nominal negative supply voltage of -5V allows for proper signal processing, essential for audio applications.

Terminal Form: GULL WING

Gull wing terminal form is standard for surface mount devices, promoting excellent solder joint reliability.

Telecom IC Type: PCM CODEC

Being a PCM codec type emphasizes its capability in handling Pulse Code Modulated audio, ensuring clarity and fidelity.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V is standard in many electronic applications, simplifying power supply requirements.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm ensures compatibility with standard PCB layouts, facilitating ease of assembly.

Filter: YES

The inclusion of a filter enhances signal quality by reducing unwanted noise, which is critical for audio processing.

Technical Specifications

Audio Codecs ETC5054D-X/H attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

ETC5054D-X/H Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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