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TCM29C16ADWR

Texas Instruments

TCM29C16ADWR by Texas Instruments

TCM29C16ADWR by Texas Instruments is an Audio Codec with +-5V power supplies, 16 terminals, and mu-law companding law. It operates in synchronous/asynchronous mode and is ideal for PCM codec applications in telecom ICs. The small outline package style makes it suitable for compact designs with a max operating temperature of 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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ACDS - Activité Composants Distribution Service

France . 4,000 parts In-Stock

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4,000

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Vyrian

USA . 2,264 parts In-Stock

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Digiode

USA . 2,116 parts In-Stock

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Component Electronics Inc.

Canada . 784 parts In-Stock

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784

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Distributors (Availability)

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AZTECH Wire

Italy . 366 parts In-Stock

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$11.503

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366

$11.503

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Parana Technologies

USA . 599 parts In-Stock

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$13.358

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$13.876

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599

$13.358

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$13.876

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ChromeModa Solutions

Germany . 3,207 parts In-Stock

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$15.009

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$12.307

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3,207

$15.009

$12.307

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IDEA Electronic Components Group

UK . 1,130 parts In-Stock

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$15.009

100+ parts

$14.259

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$13.508

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1,130

$15.009

$14.259

$13.508

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One Stop Electronics

USA . 585 parts In-Stock

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$879.000

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Perfect Parts

USA . 8,960 parts In-Stock

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Corphita

USA . 4,091 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 4,000 parts In-Stock

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Glotronic Ltd.

UK . 3,200 parts In-Stock

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3,200

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DigiPath Technology Company

USA . 418 parts In-Stock

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$13.532

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418

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$13.532

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Overview

Enhance your audio experience with the TCM29C16ADWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality audio codecs for a variety of applications. This small outline package offers synchronous/asynchronous operation, companding law, and filter capabilities, making it perfect for PCM codec applications. With a nominal supply voltage of 5V and maximum supply current of 9mA, this product provides superior performance and reliability. Upgrade your audio systems with the TCM29C16ADWR and enjoy unparalleled sound quality and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on a circuit board, saving space and reducing manufacturing costs.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Support for both synchronous and asynchronous operation gives flexibility in various applications, making it versatile.

Power Supplies (V): +-5

The dual power supply of +-5 volts provides a stable and reliable power source for the codec.

No. of Terminals: 16

Having 16 terminals allows for more connectivity options and functionalities in the device.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the codec can function effectively even in higher temperature environments.

Companding Law: MU-LAW

The MU-LAW companding law enhances the dynamic range of the audio signal, improving overall sound quality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the codec efficient and reliable.

Technical Specifications

Audio Codecs TCM29C16ADWR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.08 dB

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TCM29C16ADWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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