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TP3057BJ

Texas Instruments

TP3057BJ by Texas Instruments

TP3057BJ by Texas Instruments is an Audio Codec with a package style of IN-LINE and operates in synchronous/asynchronous mode. It has a supply voltage of +-5V, 16 terminals, and A-LAW companding law. Ideal for PCM CODEC applications in telecom ICs due to its compact size (19.56mm x 7.62mm x 5.08mm) and commercial temperature grade (-40°C to +85°C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,179 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,179

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-

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Digiode

USA . 897 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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897

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 725 parts In-Stock

1+ parts

$5.578

100+ parts

-

1k+ parts

-

10k+ parts

-

725

$5.578

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-

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Parana Technologies

USA . 718 parts In-Stock

1+ parts

$13.135

100+ parts

-

1k+ parts

$13.639

10k+ parts

-

718

$13.135

-

$13.639

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ChromeModa Solutions

Germany . 1,619 parts In-Stock

1+ parts

$14.758

100+ parts

$12.102

1k+ parts

-

10k+ parts

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1,619

$14.758

$12.102

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IDEA Electronic Components Group

UK . 1,409 parts In-Stock

1+ parts

$14.758

100+ parts

$14.020

1k+ parts

$13.282

10k+ parts

-

1,409

$14.758

$14.020

$13.282

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One Stop Electronics

USA . 758 parts In-Stock

1+ parts

$795.000

100+ parts

-

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758

$795.000

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Corphita

USA . 1,440 parts In-Stock

1+ parts

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1,440

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DigiPath Technology Company

USA . 213 parts In-Stock

1+ parts

-

100+ parts

$13.306

1k+ parts

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213

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$13.306

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Overview

Experience unparalleled audio quality with the TP3057BJ by Texas Instruments, a leading manufacturer in the industry. This Audio Codec is perfect for a wide range of applications, delivering crystal-clear sound and reliable performance. With its compact design and advanced technology, customers can expect seamless operation and exceptional value. Upgrade your audio systems today with the TP3057BJ and enjoy the benefits of superior sound quality and precision engineering.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material ensures durability and reliability of the product, making it suitable for long-term use in various conditions.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Allows for flexibility in operation depending on the specific requirements of the application, making it versatile and adaptable.

Power Supplies (V): +-5

Wide range of power supply options allows for compatibility with different systems and easy integration.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making the product efficient and reliable.

Nominal Supply Voltage: 5 V

Standard voltage supply ensures compatibility with many systems and simplifies the overall setup process.

Filter: YES

Inclusion of a filter enhances the audio quality by reducing noise and improving signal clarity, resulting in a superior listening experience.

Technical Specifications

Audio Codecs TP3057BJ attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TP3057BJ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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