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ETC5057D-X/HTR

STMicroelectronics

ETC5057D-X/HTR by STMicroelectronics

ETC5057D-X/HTR by STMicroelectronics is a CMOS PCM codec designed for audio applications, featuring a compact 16-terminal SO package. It operates in synchronous/asynchronous modes with a max temp of 70 °C and supports A-LAW companding. Ideal for telecom systems, it ensures high-quality audio processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,121 parts In-Stock

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Digiode

USA . 4,591 parts In-Stock

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4,591

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Anansix

USA . 269 parts In-Stock

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269

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ComSIT Distribution GmbH

Germany . 66 parts In-Stock

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66

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Microchip USA

USA . 175 parts In-Stock

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$1.484

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175

$1.484

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IDEA Electronic Components Group

UK . 2,229 parts In-Stock

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$14.716

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$13.245

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2,229

$14.716

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$13.245

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AZTECH Wire

Italy . 483 parts In-Stock

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$19.350

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483

$19.350

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MKK Technologies

India . 526 parts In-Stock

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$27.673

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526

$27.673

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DigiPath Technology Company

USA . 526 parts In-Stock

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$27.673

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526

$27.673

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Corphita

USA . 2,403 parts In-Stock

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Northwest PG Solutions

USA . 1,260 parts In-Stock

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Parana Technologies

USA . 1,256 parts In-Stock

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$17.596

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$17.596

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Kepictronics

USA . 943 parts In-Stock

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943

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Native Components

USA . 707 parts In-Stock

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707

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Perfect Parts

USA . 7 parts In-Stock

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Overview

Elevate your audio solutions with the ETC5057D-X/HTR from STMicroelectronics, a trusted leader in innovative technology. This high-quality audio codec ensures crystal-clear sound in both synchronous and asynchronous modes, making it ideal for telecommunications and multimedia applications. Designed for durability with a compact form factor, it delivers exceptional performance while simplifying integration, giving you the competitive edge in any project. Experience unmatched reliability and sound fidelity today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy not only ensures durability and resistance to environmental factors but also aids in cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for more efficient use of circuit board space and enables higher component density, making this product suitable for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout and enhances thermal performance, which is essential for audio codec reliability.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Having both synchronous and asynchronous operating modes makes this codec versatile, allowing it to be used in a variety of applications.

No. of Terminals: 16

With 16 terminals, this product provides sufficient connectivity options while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for applications where space is limited but performance is paramount.

Maximum Operating Temperature: 70 °C

The ability to operate at temperatures up to 70 °C ensures reliability in diverse environmental conditions.

Minimum Operating Temperature: 0 °C

Functional performance from 0 °C allows this codec to be used in a wide range of temperature-sensitive applications.

Terminal Position: DUAL

Dual terminal position simplifies PCB layout and enhances soldering reliability, ensuring effective connections.

Maximum Seated Height: 2.65 mm

The low seated height helps with space efficiency on PCBs, making it suitable for low-profile designs.

Width: 7.5 mm

With a width of 7.5 mm, this codec can easily fit into narrow spaces, adding to its versatility in design.

Companding Law: A-LAW

The A-LAW companding law is commonly used in European telecommunications, ensuring compatibility for audio processing applications.

Length: 10.3 mm

The compact length further supports space-saving designs, making it ideal for modern electronic devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this codec is suitable for general-purpose applications, enhancing its market appeal.

Technology: CMOS

CMOS technology provides low power consumption and high efficiency, making it ideal for battery-operated devices.

Nominal Negative Supply Voltage: -5 V

A nominal negative supply voltage of -5 V expands the operating range for various audio applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliability in connections, ensuring long-term performance.

Telecom IC Type: PCM CODEC

As a PCM codec, this product is optimized for pulse code modulation, widely used in digital audio processing.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is a standard in many electronic systems, ensuring compatibility across various devices.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm promotes better routing flexibility and enhanced soldering precision for manufacturers.

Filter: YES

The inclusion of a filter improves audio signal quality by reducing noise, making it a key consideration for audio fidelity.

Technical Specifications

Audio Codecs ETC5057D-X/HTR attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Companding Law:

A-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

ETC5057D-X/HTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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