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TLV320AIC12IDBTG4

Texas Instruments

TLV320AIC12IDBTG4 by Texas Instruments

TLV320AIC12IDBTG4 by Texas Instruments is a 30-terminal audio codec with 4 channels, operating at -40 to 85°C. It features twos complement output/input codes, synchronous mode, and supports voltage outputs up to 2.35V. Ideal for industrial applications requiring programmable codecs in compact form factors.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,529 parts In-Stock

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5,529

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Digiode

USA . 259 parts In-Stock

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259

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Distributors (Availability)

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Parana Technologies

USA . 1,663 parts In-Stock

1+ parts

$14.186

100+ parts

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$14.641

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1,663

$14.186

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$14.641

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AZTECH Wire

Italy . 828 parts In-Stock

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$14.220

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Advanced Electronics

New Zealand . 60 parts In-Stock

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$14.965

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$13.618

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$12.271

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60

$14.965

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$12.271

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DigiPath Technology Company

USA . 1,425 parts In-Stock

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$15.620

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ChromeModa Solutions

Germany . 1,916 parts In-Stock

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$15.939

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$13.070

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$15.939

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IDEA Electronic Components Group

UK . 258 parts In-Stock

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$15.939

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$15.142

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$14.345

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258

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$14.345

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Component Stockers USA

USA . 724 parts In-Stock

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$99.990

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One Stop Electronics

USA . 639 parts In-Stock

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$880.000

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QUARKTWIN TECHNOLOGY LTD

USA . 10,119 parts In-Stock

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Microchip USA

USA . 3,984 parts In-Stock

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Corphita

USA . 2,662 parts In-Stock

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Overview

Experience exceptional audio quality and performance with the TLV320AIC12IDBTG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-of-the-line Audio Codecs designed for a wide range of applications. This programmable codec offers customers unbeatable value, benefits, and advantages, making it the ideal choice for your audio processing needs. Upgrade your audio systems today with the TLV320AIC12IDBTG4 and enjoy unparalleled sound quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to wear and tear.

Surface Mount: YES

Surface mount technology allows for easy installation and reduces the overall size of the product, making it suitable for compact designs.

Output Code: TWOS COMPLEMENT

Twos complement encoding provides a more accurate representation of analog signals, resulting in high-quality audio output.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and synchronization, essential for audio applications to deliver seamless sound output.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages gives flexibility in design and allows compatibility with different systems.

No. of Terminals: 30

The large number of terminals provides ample connectivity options, allowing for versatile integration in various circuits.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and maintain performance reliability.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures consistent operation in demanding settings, suitable for professional audio equipment.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy-efficient and reliable audio processing.

Resolution (um): 16

The high resolution enables precise digital-to-analog conversion, preserving audio quality and fidelity during signal processing.

Filter: YES

Built-in filters help eliminate noise and interference, enhancing audio clarity and improving the overall listening experience.

Technical Specifications

Audio Codecs TLV320AIC12IDBTG4 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V ANALOG SUPPLY

Maximum Analog Input:

2 V

Filter:

YES

Input Code:

TWOS COMPLEMENT

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

30

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Maximum Output Voltage:

2.35 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP30,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Resolution (um):

16

Maximum Seated Height:

1.2 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TLV320AIC12IDBTG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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