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TCM129C13ADW

Texas Instruments

TCM129C13ADW by Texas Instruments

TCM129C13ADW by Texas Instruments is an Audio Codec with +-5V power supplies, 20 terminals, and A/MU-LAW companding law. It operates in synchronous/asynchronous mode for PCM codec applications. This industrial-grade CMOS technology device has a small outline package style ideal for telecom ICs.

Median Price

$1.230

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22,441 parts In-Stock

1+ parts

-

100+ parts

$1.230

1k+ parts

$1.020

10k+ parts

$0.910

22,441

-

$1.230

$1.020

$0.910

DigiKey

USA . 22,441 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.050

10k+ parts

-

22,441

-

-

$1.050

-

Verical

USA . 20,549 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.275

10k+ parts

$1.138

20,549

-

-

$1.275

$1.138

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 761 parts In-Stock

1+ parts

$0.960

100+ parts

-

1k+ parts

-

10k+ parts

-

761

$0.960

-

-

-

Vyrian

USA . 3,786 parts In-Stock

1+ parts

$1.010

100+ parts

-

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-

10k+ parts

-

3,786

$1.010

-

-

-

Bristol Electronics

USA . 31,405 parts In-Stock

1+ parts

-

100+ parts

-

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31,405

-

-

-

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Atlantic Semiconductor

USA . 31,405 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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31,405

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-

-

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ACDS - Activité Composants Distribution Service

France . 198 parts In-Stock

1+ parts

-

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198

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,999 parts In-Stock

1+ parts

$0.909

100+ parts

-

1k+ parts

-

10k+ parts

-

4,999

$0.909

-

-

-

Parana Technologies

USA . 547 parts In-Stock

1+ parts

$12.533

100+ parts

-

1k+ parts

$12.982

10k+ parts

-

547

$12.533

-

$12.982

-

DigiPath Technology Company

USA . 1,888 parts In-Stock

1+ parts

$13.800

100+ parts

$12.696

1k+ parts

-

10k+ parts

-

1,888

$13.800

$12.696

-

-

ChromeModa Solutions

Germany . 6,414 parts In-Stock

1+ parts

$14.082

100+ parts

$11.547

1k+ parts

-

10k+ parts

-

6,414

$14.082

$11.547

-

-

IDEA Electronic Components Group

UK . 755 parts In-Stock

1+ parts

$14.082

100+ parts

$13.378

1k+ parts

$12.674

10k+ parts

-

755

$14.082

$13.378

$12.674

-

Benley Electronics

USA . 18,800 parts In-Stock

1+ parts

-

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10k+ parts

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18,800

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A-Z Elektronik GmbH

Germany . 4,913 parts In-Stock

1+ parts

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4,913

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Perfect Parts

USA . 444 parts In-Stock

1+ parts

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444

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Kepictronics

USA . 200 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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200

-

-

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Cyclops Electronics Ltd (Excess)

UK . 198 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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198

-

-

-

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Glotronic Ltd.

UK . 158 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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158

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-

Overview

Experience unparalleled audio quality with the TCM129C13ADW by Texas Instruments, a leading manufacturer known for its superior products. As part of the Audio Codecs category, this device offers seamless integration and outstanding performance in various applications. With its compact design and advanced technology, customers can enjoy crystal-clear sound and reliable operation in any environment. Elevate your audio experience with the TCM129C13ADW and discover the difference that quality craftsmanship and innovation can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable audio devices.

Surface Mount: YES

Surface mount technology enables easy and efficient assembly on circuit boards, saving space and reducing production costs.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in synchronous or asynchronous modes provides flexibility in integrating the codec into different audio systems.

Power Supplies (V): +-5

Support for dual power supplies of +-5V ensures stable and reliable operation of the audio codec.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact audio devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the codec can function effectively even in demanding industrial environments.

Companding Law: A/MU-LAW

The A/MU-Law companding law ensures efficient encoding and decoding of audio signals with minimal distortion, ensuring high-quality sound output.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the audio codec.

Technical Specifications

Audio Codecs TCM129C13ADW attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TCM129C13ADW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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